STM915-16 datasheet(5/7 Pages) STMICROELECTRONICS

tên linh kiện	STM915-16

Giải thích chi tiết về linh kiện	RF POWER MODULE GSM MOBILE APPLICATIONS

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APPLICATIONS RECOMMENDATIONS

OPERATION LIMITS

The STM915-16 power module should never be

operated under any condition which exceeds

the Absolute Maximum Ratings presented on

this data sheet. Nor should the module be

operated continuously at any of the specified

maximum ratings. If the module is to be

operated under any condition such that it may

be subjected to one or more of the maximum

rating conditions, care must be taken to monitor

other parameters which may be affected. For

example, a combination of high VS3 and input

overdrive

could

result

in

exceeding

the

maximum output power rating; in this condition,

the output power must be maintained below the

maximum rating by use of the gain control pin.

GAIN CONTROL

The module output power should be limited to

20 watts (43 dBm). The module is designed to

be operated with VS1 and VS3 set to 8.0 Vdc,

VS2 and VS4 set to 12.5 Vdc and input power

set to 1.0 mW (0 dBm). Module gain is adjusted

by varying VCONTROL.

DECOUPLING

The bypassing internal to the module is

sufficient for the frequency range 90-1300 MHz.

Care

should

be

taken

to

insure

proper

decoupling for each application as the module

is capable of a wide range of operating

characteristics including ”linear” operation, in

which an important design criteria is the use of

appropriate bypassing. For

bypassing low

frequencies while maintaining the electrical

specifications contained in this data sheet, use

of the decoupling network shown in the ”Module

DC and Test Fixture Configuration” diagram

herein is recommended.

MODULE MOUNTING

To insure adequate thermal transfer from the

module to the heatsink, it is recommended that

a satisfactory thermal compound such as Dow

Corning 340, Wakefield 120-2 or equivalent be

applied between the module flange and the

heatsink.

The heatsink mounting surface under the module

should be flat to within

± 0.05 mm (± 0.002 inch).

The module should be mounted to the heatsink

using 3 mm (or 4-40) or equivalent screws

torqued to 5-6 kg-cm (4-6 in-lb).

The module leads are attached to the equipment

PC board using 180

°C solder applied to the leads

with it properly grounded soldering iron trip, not to

exceed 195

°C, applied a minimum of 2 mm

(0.080 inch) from the body of the module for a

duration not to exceed 15 seconds per lead. It is

imperative that no other portion of the module,

other

than

the

leads,

be

subjected

to

temperatures in excess of 100

°C (maximum

storage temperature), for any period of time, as

the plastic moulded cover, internal components

and sealing adhesives may be adversely affected

by such conditions.

Due to the construction techniques and the

materials

used

within

the

module,

reflow

soldering of the flange heatsink or leads, is not

recommended.

THERMAL CONSIDERATIONS

It will be necessary to provide a suitable heatsink

in

order

to

maintain

the

module

flange

temperature at or below the maximum case

operating temperature. In a case where the

module output power will be limited to +42 dBm

(16 W) and designing for the worst case

efficiency of 35%, the power dissipated by the

module will be 29.7 watts. The heatsink must be

designed such that the thermal rise will be less

than the

difference between the

maximum

ambient temperature at which the module will

operate and

the

maximum

operating

case

temperature of the module while dissipating 29.7

watts.

STM915-16

5/7

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