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ADXL180 bảng dữ liệu(PDF) 7 Page - Analog Devices |
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ADXL180 bảng dữ liệu(HTML) 7 Page - Analog Devices |
7 / 56 page ADXL180 Rev. 0 | Page 7 of 56 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating Supply Voltage (VBP − VBN) −0.3 V to +21 V Voltage at Any Pin with Respect to VBN Except VBP −0.3 V to VDD + 0.3 V Storage Temperature Range −55°C to +150°C Soldering Temperature 255°C Operating Temperature Range −40°C to +125°C ESD All Pins 1.5 kV HBM Latch-Up Current 100 mA Mechanical Shock Unpowered ±4000 g (0.5 ms, half sine) Powered ±2000 g (0.5 ms, half sine); −0.3 V to +7.0 V Drop Test (onto Concrete)1 1.2 m Thermal Gradient ±20°C/minute 1 Soldered to FR4 coupon printed circuit board (PCB) at the dimensions of 25.4 mm × 25 mm. During test, the PCB is fastened to a support with 46 g mass, equivalent to a typical satellite module PCB. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION RAMP-DOWN RAMP-UP CRITICAL ZONE tL TO tP TA = 25°C tL tP TIME t = 25°C TO PEAK tS PREHEAT tL tP TSMIN TSMAX Figure 2. ADXL180 Pb-Free Solder Profile Table 3. ADXL Solder Profile Parameters Profile Feature Small Body Pb-Free Assemblies Average Ramp-Up Rate (TL to TP) 3°C/second maximum Preheat Temperature Min (TS min) to Temperature Max (TS max) 150°C to 200°C Time (min to max) (tS) 60 sec to 180 sec TS max to TL Ramp-Up Rate 3°C/second maximum Time Maintained Above Temperature (TL) 217°C Time (tL) 60 sec to 150 sec Peak Temperature (TP) 260°C +5/−5°C Time Within 5°C of Actual Peak Temperature (tP) 20 sec to 40 sec Ramp-Down Rate 6°C/sec maximum Time 25°C to Peak Temperature 8 minutes maximum |
Số phần tương tự - ADXL180 |
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Mô tả tương tự - ADXL180 |
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