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3 / 9 page 3/9 STB3NC90Z ELECTRICAL CHARACTERISTICS (CONTINUED) SWITCHING ON SWITCHING OFF SOURCE DRAIN DIODE GATE-SOURCE ZENER DIODE Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %. 2. Pulse width limited by safe operating area. 3. ∆VBV = αT (25°-T) BVGSO(25°) PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be applied from gate to souce. In this respect the 25V Zener voltage is appropiate to achieve an efficient and cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the usage of external components. Symbol Parameter Test Conditions Min. Typ. Max. Unit td(on) Turn-on Delay Time Rise Time VDD = 450 V, ID = 1.5 A RG = 4.7Ω VGS = 10V (see test circuit, Figure 3) 28 ns tr 14 ns Qg Total Gate Charge VDD = 720V, ID = 3A, VGS = 10V 27 38 nC Qgs Gate-Source Charge 8 nC Qgd Gate-Drain Charge 10 nC Symbol Parameter Test Conditions Min. Typ. Max. Unit tr(Voff) Off-voltage Rise Time VDD = 720V, ID = 3 A, RG =4.7Ω, VGS = 10V (see test circuit, Figure 5) 16 ns tf Fall Time 10 ns tc Cross-over Time 18 ns Symbol Parameter Test Conditions Min. Typ. Max. Unit ISD Source-drain Current 3.5 A ISDM (2) Source-drain Current (pulsed) 14 A VSD (1) Forward On Voltage ISD = 3 A, VGS = 0 1.6 V trr Reverse Recovery Time ISD = 3 A, di/dt = 100A/µs, VDD = 100V, Tj = 150°C (see test circuit, Figure 5) 712 ns Qrr Reverse Recovery Charge 4450 µC IRRM Reverse Recovery Current 13 A Symbol Parameter Test Conditions Min. Typ. Max. Unit BVGSO Gate-Source Breakdown Voltage Igs=± 1mA (Open Drain) 25 V αT Voltage Thermal Coefficient T=25°C Note(3) 1.3 10-4/°C Rz Dynamic Resistance ID = 50 mA 90 Ω |
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