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KMPC860TZQ80D4 bảng dữ liệu(PDF) 10 Page - Freescale Semiconductor, Inc

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MPC860 PowerQUICC™ Family Hardware Specifications, Rev. 8
10
Freescale Semiconductor
Power Dissipation
5
Power Dissipation
Table 5 provides power dissipation information. The modes are 1:1, where CPU and bus speeds are equal,
and 2:1, where CPU frequency is twice the bus speed.
NOTE
Values in Table 5 represent VDDL-based power dissipation and do not
include I/O power dissipation over VDDH. I/O power dissipation varies
widely by application due to buffer current, depending on external circuitry.
6
DC Characteristics
Table 6 provides the DC electrical characteristics for the MPC860.
Table 5. Power Dissipation (PD)
Die Revision
Frequency (MHz)
Typical 1
1 Typical power dissipation is measured at 3.3 V.
Maximum 2
2 Maximum power dissipation is measured at 3.5 V.
Unit
D.4
(1:1 mode)
50
656
735
mW
66
TBD
TBD
mW
D.4
(2:1 mode)
66
722
762
mW
80
851
909
mW
Table 6. DC Electrical Specifications
Characteristic
Symbol
Min
Max
Unit
Operating voltage at 40 MHz or less
VDDH, VDDL, VDDSYN
3.0
3.6
V
KAPWR
(power-down mode)
2.0
3.6
V
KAPWR
(all other operating modes)
VDDH – 0.4
VDDH
V
Operating voltage greater than 40 MHz
VDDH, VDDL, KAPWR,
VDDSYN
3.135
3.465
V
KAPWR
(power-down mode)
2.0
3.6
V
KAPWR
(all other operating modes)
VDDH – 0.4
VDDH
V
Input high voltage (all inputs except EXTAL and
EXTCLK)
VIH
2.0
5.5
V
Input low voltage1
VIL
GND
0.8
V
EXTAL, EXTCLK input high voltage
VIHC
0.7
× (VDDH)VDDH + 0.3
V
Input leakage current, Vin = 5.5 V (except TMS, TRST,
DSCK, and DSDI pins)
Iin
100
µA


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