STM32F103ZC datasheet(7/118 Pages) STMICROELECTRONICS

tên linh kiện	STM32F103ZC

Giải thích chi tiết về linh kiện	Performance line, ARM-based 32-bit MCU with up to 512 KB Flash, USB, CAN, 11 timers, 3 ADCs and 13 communication interfaces

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nhà sản xuất	STMICROELECTRONICS [STMicroelectronics]

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STM32F103xC, STM32F103xD, STM32F103xE

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Figure 44.

SPI timing diagram - slave mode and CPHA = 1(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92

Figure 45.

SPI timing diagram - master mode(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

Figure 46.

I2S slave timing diagram(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

Figure 47.

I2S master timing diagram(1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

Figure 48.

SDIO high-speed mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96

Figure 49.

SD default mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96

Figure 50.

USB timings: definition of data signal rise and fall time . . . . . . . . . . . . . . . . . . . . . . . . . . . 98

Figure 51.

ADC accuracy characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101

Figure 52.

Typical connection diagram using the ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102

Figure 53.

Power supply and reference decoupling (VREF+ not connected to VDDA). . . . . . . . . . . . . 102

Figure 54.

Power supply and reference decoupling (VREF+ connected to VDDA). . . . . . . . . . . . . . . . 103

Figure 55.

LQFP144, 20 x 20 mm, 144-pin low-profile quad

flat package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107

Figure 56.

Recommended footprint(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107

Figure 57.

LFBGA100 - low profile fine pitch ball grid array package outline . . . . . . . . . . . . . . . . . . 108

Figure 58.

Recommended PCB design rules (0.80/0.75 mm pitch BGA) . . . . . . . . . . . . . . . . . . . . . 109

Figure 59.

LQFP100, 100-pin low-profile quad flat package outline . . . . . . . . . . . . . . . . . . . . . . . . . 110

Figure 60.

Recommended footprint(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110

Figure 61.

LQFP64 – 64 pin low-profile quad flat package outline . . . . . . . . . . . . . . . . . . . . . . . . . . 111

Figure 62.

Recommended footprint(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111

Figure 63.

LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm,

0.8 mm pitch, package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112

Figure 64.

LQFP100 PD max vs. TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

Số phần tương tự - STM32F103ZC

nhà sản xuất	tên linh kiện	bảng dữ liệu	Giải thích chi tiết về linh kiện
STMicroelectronics	STM32F103ZC	1Mb / 123P	High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces
	STM32F103ZC	1Mb / 130P	High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN
	STM32F103ZC	1Mb / 130P	High-density performance line ARM-based 32-bit MCU
	STM32F103ZC	3Mb / 143P	High-density performance line Arm®-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces July 2018
	STM32F103ZCH6	1Mb / 130P	High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces

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Mô tả tương tự - STM32F103ZC

nhà sản xuất	tên linh kiện	bảng dữ liệu	Giải thích chi tiết về linh kiện
STMicroelectronics	STM32F103VDT6	1Mb / 130P	High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces
	STM32F103XC	1Mb / 123P	High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces
	STM32F103ZCH6	1Mb / 130P	High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces
	STM32F103ZEH6	1Mb / 130P	High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces
	STM32F103RCT7	1Mb / 130P	High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces
	STM32F103ZDT6	1Mb / 130P	High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces
	STM32F103ZEH7	1Mb / 130P	High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces
	STM32F103XC	3Mb / 143P	High-density performance line Arm®-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces July 2018
	STM32F103ZGT6	2Mb / 120P	XL-density performance line ARM-based 32-bit MCU with 768 KB to 1 MB Flash, USB, CAN, 17 timers, 3 ADCs, 13 communication interfaces
	STM32F103RGT6	2Mb / 120P	XL-density performance line ARM-based 32-bit MCU with 768 KB to 1 MB Flash, USB, CAN, 17 timers, 3 ADCs, 13 communication interfaces

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