Analog Integrated Circuit Device Data

Freescale Semiconductor

5

33810

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. Maximum Ratings

All voltages are with respect to ground unless otherwise noted.

Ratings

Symbol

Value

Unit

ELECTRICAL RATINGS

VPWR Supply Voltage(1)

-1.5 to 45

VDD Supply Voltage(1)

-0.3 to 7.0

SPI Interface and Logic Input Voltage (CS, SI, SO, SCLK, OUTEN,

DIN0 - DIN3, GIN0 - GIN3, SPKDUR, NOMI, MAXI, RSP,RSN)

-0.3 to VDD

-1.5 to 60

Injector Output Voltage (OUTx)

-1.5 to 60

General Purpose Gate Pre-driver Output Voltage (GDx)

-0.3 to 10

Output Clamp Energy (OUT0 to OUT3)(Single Pulse)

100

mJ

Output Clamp Energy (OUT0 to OUT3)(Continuous Pulse)

100

mJ

Output Continuous Current (OUT0 to OUT3)

2.0

A

Maximum Voltage for RSN and RSP inputs

-0.3 - VDD

Frequency of SPI Operation (VDD = 5.0V)

–

6.0

MHz

ESD Voltage(2), (3)

Human Body Model (HBM)

Machine Model (MM)

Charge Device Model (CDM)

±2000

±200

±750

V

THERMAL RATINGS

Operating Temperature

Ambient

Junction2

Case

-40 to 125

-40 to 150

-40 to 125

Storage Temperature

-55 to 150

1.7

W

Peak Package flow Temperature During Solder Mounting

DWB Suffix

EW Suffix

240

245

Thermal Resistance

Junction-to-Ambient

Junction- to-Lead

Junction-to-Flag

75

8.0

1.2

°C/W

Notes

1.

Exceeding these limits may cause malfunction or permanent damage to the device.

2.

ESD data available upon request.

3.

ESD testing is performed in accordance with the Human Body Model (HBM) (AEC-Q100-002), the Machine Model (MM) (AEC-Q100-

003), and the Charge Device Model (CDM), Robotic (AEC-Q100-011).