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LM3940 bảng dữ liệu(PDF) 3 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
tên linh kiện LM3940
Giải thích chi tiết về linh kiện  1A Low Dropout Regulator for 5V to 3.3V Conversion
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nhà sản xuất  NSC [National Semiconductor (TI)]
Trang chủ  http://www.national.com
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LM3940 bảng dữ liệu(HTML) 3 Page - National Semiconductor (TI)

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Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Storage Temperature Range
−65˚C to +150˚C
Operating Junction Temperature Range −40˚C to +125˚C
Lead Temperature (Soldering, 5 seconds)
260˚C
Power Dissipation (Note 2)
Internally Limited
Input Supply Voltage
7.5V
ESD Rating (Note 3)
2 kV
Electrical Characteristics
Limits in standard typeface are for T
J = 25˚C, and limits in boldface type apply over the full operating temperature range. Un-
less otherwise specified: V
IN = 5V, IL = 1A, COUT = 33 µF.
Symbol
Parameter
Conditions
Typical
LM3940 (Note 4)
Units
min
max
V
O
Output Voltage
5 mA
≤ I
L
≤ 1A
3.3
3.20
3.40
V
3.13
3.47
Line Regulation
I
L =5 mA
20
40
mV
4.5V
≤ V
O
≤ 5.5V
Load Regulation
50 mA
≤ I
L
≤ 1A
35
50
80
Z
O
Output Impedance
I
L (DC) = 100 mA
I
L (AC) = 20 mA (rms)
35
m
f = 120 Hz
I
Q
Quiescent Current
4.5V
≤ V
IN
≤ 5.5V
10
15
mA
I
L =5 mA
20
V
IN = 5V
110
200
I
L =1A
250
e
n
Output Noise Voltage
BW = 10 Hz–100 kHz
150
µV (rms)
I
L =5 mA
V
O −VIN
Dropout Voltage
I
L = 1A
0.5
0.8
V
(Note 5)
1.0
I
L = 100 mA
110
150
mV
200
I
L(SC)
Short Circuit Current
R
L = 0
1.7
1.2
A
Thermal Performance
Thermal Resistance
Junction-to-Case
3-Lead TO-220
4
˚C/W
3-Lead TO-263
4
˚C/W
Thermal Resistance
Junction-to-Ambient
3-Lead TO-220
60
˚C/W
3-Lead TO-263
80
˚C/W
8-Lead LLP (Note 2)
35
˚C/W
Note 1: Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating the
device outside of its rated operating conditions.
Note 2: The maximum allowable power dissipation is a function of the maximum junction temperature, TJ, the junction-to-ambient thermal resistance, θJA, and the
ambient temperature, TA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown.
The value of
θJA (for devices in still air with no heatsink) is 60˚C/W for the TO-220 package, 80˚C/W for the TO-263 package, and 174˚C/W for the SOT-223 package.
The effective value of
θJA can be reduced by using a heatsink (see Application Hints for specific information on heatsinking). The value of θJA for the LLP package
is specifically dependant on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for
the LLP package, refer to Application Note AN-1187. It is recommended that 6 vias be placed under the center pad to improve thermal performance.
Note 3: ESD rating is based on the human body model: 100 pF discharged through 1.5 k
Ω.
Note 4: All limits guaranteed for TJ = 25˚C are 100% tested and are used to calculate Outgoing Quality Levels. All limits at temperature extremes are guaranteed
via correlation using standard Statistical Quality Control (SQC) methods.
Note 5: Dropout voltage is defined as the input-output differential voltage where the regulator output drops to a value that is 100 mV below the value that is
measured at VIN =5V.
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