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LM3551SD bảng dữ liệu(PDF) 4 Page - National Semiconductor (TI) |
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LM3551SD bảng dữ liệu(HTML) 4 Page - National Semiconductor (TI) |
4 / 15 page Electrical Characteristics(Notes 2, 9) (Continued) Limits in standard typeface are for T J = +25˚ C. Limits in boldface type apply over the full operating junction temperature range (-40˚C ≤ T J ≤ +110˚C). Unless otherwise noted, specifications apply to the LM3551 and LM3552 Typical Application Circuit (pg. 1) with: V IN = 3.6V, V(SD) = 0V for LM3551 and V(EN) = VIN for LM3552, ILOAD = 0A (Note 10) Symbol Parameter Conditions Min Typ Max Units Th T/F T/F Pin Threshold Output High 1.2 V Output Low 0.3 UVP Under Voltage Protection Thresholds On Threshold 2.25 2.48 2.70 V Off Threshold 2.43 2.58 2.77 OVP Over Voltage Protection Thresholds On Threshold 11.3 12.4 14 V Off Threshold 9.2 10.6 12 V FTO Flash Timeout trip-point 0.99 1.16 1.32 V I FTO Flash Timeout Current 1.12 1.4 1.68 µA V SS Soft-Start Voltage 1.18 1.25 1.32 V I SS Soft-Start Current 10 11.5 13 µA Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. Note 2: All voltages are with respect to the potential at the GND pin. Note 3: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=140 oC (typ.) and disengages at TJ=120 oC (typ.). Note 4: For detailed soldering specifications and information, please refer to National Semiconductor Application Note: AN-1187 for Recommended Soldering Profiles. Note 5: The human body model is a 100pF capacitor discharged through a 1.5k Ω resistor into each pin. (MIL-STD-883 3015.7) Note 6: Maximum recommended SW pin voltage when the OVP pin is grounded. Note 7: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =110 oC), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the part/package in the application (θJA), as given by the following equation: TA-MAX =TJ-MAX-OP –(θJA xPD-MAX). Note 8: Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. Note 9: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical (Typ) numbers are not guaranteed, but do represent the most likely norm. Unless otherwise specified, conditions for Typ specifications are: VIN = 3.6V and TA =25 oC. Note 10: CIN and COUT,: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics Note 11: Duty cycle affects current limit due to ramp generator. Note 12: Current limit at 0% duty cycle. See TYPICAL PERFORMANCE section for Switch Current Limit vs. VIN Note 13: Bias current flows into FB pin. www.national.com 4 |
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