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Page 8 of 8

Issue A

LANSDALE Semiconductor, Inc.

ML145403, ML145404, ML145405, ML145408

SO 20W = -6P

(ML145403-6P, ML145404-6P, ML145405-6P)

OUTLINE DIMENSIONS

SOG PACKAGE

CASE 751D–04

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.150

(0.006) PER SIDE.

5. DIMENSION D DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.13

(0.005) TOTAL IN EXCESS OF D DIMENSION

AT MAXIMUM MATERIAL CONDITION.

–A–

–B–

20

1

11

10

S

A

M

0.010 (0.25)

T

D

20X

M

B

M

0.010 (0.25)

P

10X

J

F

G

18X

K

C

PLANE

M

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

12.65

12.95

0.499

0.510

B

7.40

7.60

0.292

0.299

C

2.35

2.65

0.093

0.104

D

0.35

0.49

0.014

0.019

F

0.50

0.90

0.020

0.035

G

1.27 BSC

0.050 BSC

J

0.25

0.32

0.010

0.012

K

0.10

0.25

0.004

0.009

M

0

7

0

7

P

10.05

10.55

0.395

0.415

R

0.25

0.75

0.010

0.029

SO 24W = -6P

(ML145408-6P)

SOG PACKAGE

CASE 751E–04

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN

EXCESS OF D DIMENSION AT MAXIMUM

MATERIAL CONDITION.

–A–

–B–

P

12X

D

24X

12

13

24

1

M

0.010 (0.25)

S

A

M

0.010 (0.25)

T

–T–

G

22X

SEATING

PLANE

K

C

M

F

J

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

15.25

15.54

0.601

0.612

B

7.40

7.60

0.292

0.299

C

2.35

2.65

0.093

0.104

D

0.35

0.49

0.014

0.019

F

0.41

0.90

0.016

0.035

G

1.27 BSC

0.050 BSC

J

0.23

0.32

0.009

0.013

K

0.13

0.29

0.005

0.011

M

0

8

0

8

P

10.05

10.55

0.395

0.415

R

0.25

0.75

0.010

0.029

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ty, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit

described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which

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