3

MAY 1989 - REVISED MARCH 1997

TIPP110, TIPP111, TIPP112

NPN SILICON POWER DARLINGTONS

PRODUCT

INFORMATION

LP003 (TO-92)

3-pin cylindical plastic package

This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic

compound. The compound will withstand soldering temperature with no deformation, and circuit performance

characteristics will remain stable when operated in high humidity conditions. Leads require no additional

cleaning or processing when used in soldered assembly.

MECHANICAL DATA

ALL LINEAR DIMENSIONS IN MILLIMETERS

12,7 MIN.

2,03

2,67

4,44

5,21

3,43 MIN.

4,32

5,34

0,40

0,56

1,14

1,40

2,41

2,67

0,35

0,41

2,03

2,67

3,17

4,19

(see Note A)

Seating Plane

1

2

3

LP003 (TO-92)

LP003 Falls Within JEDEC

TO-226AA Dimensions

MDXXAX

1,27

NOTE A: Lead dimensions are not controlled in this area.