MC33076

http://onsemi.com

8

Figure 26. Percent Overshoot

versus Load Capacitance

10 k

1000

100

10

100

80

60

40

20

0

Figure 27. PC Board Heatsink Example

Copper

Pad

Copper

Pad

APPLICATIONS INFORMATION

The MC33076 dual operational amplifier is available in

the standard 8–pin plastic dual–in–line (DIP) and surface

mount packages, and also in a 16–pin batwing power

package. To enhance the power dissipation capability of the

power package, Pins 4, 5, 12, and 13 are tied together on the

leadframe, giving it an ambient thermal resistance of

52

°C/W typically, in still air. The junction–to–ambient

a copper padb on the printed circuit board (as shown in

Figure 27) to draw the heat away from the package. Care

must be taken not to exceed the maximum junction

temperature or damage to the device may occur.