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MC-SP150DNB
Single Color Surface
Mounted Chip LED
Size :0805
Features
•
Operating Temperature: -30
to +80
•
Storage Temperature: -40
to +85
•
84 mWatt DC Power Dissipation
•
Reverse Voltage:5.0V
•
Forward Current:30 mA
•
Peak Forward Current:100**mA(IF)
** Pulse test: Pulse width
0.1msec, Duty cycle
10%
L
I
Revision: 1
2005/10/21
0.047”
0.047”
0.035”
SUGGESTED SOLDER
PAD LAYOUT
DIMENSIONS
INCHES
MM
DIM
MIN
MAX
MIN
MAX
NOTE
A
0.021
0.029
0.525
0.725
B
0.045
0.053
1.15
1.35
C
0.075
0.083
1.9
2.1
D
0.045
0.053
1.15
1.35
E
0.051
0.059
1.3
1.5
F
0.008
0.016
0.2
0.4
G
0.016
0.024
0.4
0.6
H
0.039
0.047
1.0
1.2
J
0.012
0.020
0.3
0.5
K
0.043
0.051
1.1
1.3
Conventional type
MST
Figure
1
L
Luminous IIntensity VS .Forward Current
Forward Current IF (mA)
10
10
10
10
1
10
100
1000
•
Apply For LCD Display,Indicators,Illuminations, etc.
•
Compatible With Automatic Placement Equipment
•
Compatible With Reflow Solder Process
Maximum Ratings