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TC10722.6VCT713 bảng dữ liệu(PDF) 2 Page - Microchip Technology |
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2 / 22 page TC1072/TC1073 DS21354D-page 2 © 2007 Microchip Technology Inc. 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings† Input Voltage .........................................................6.5V Output Voltage........................... (-0.3V) to (VIN + 0.3V) Power Dissipation................Internally Limited (Note 6) Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V Operating Temperature Range...... -40°C < TJ < 125°C Storage Temperature..........................-65°C to +150°C † Note: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC1072/TC1073 ELECTRICAL SPECIFICATIONS Electrical Characteristics: Unless otherwise noted, VIN =VOUT + 1V, IL = 0.1 mA, CL =3.3 μF, SHDN >VIH, TA =+25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Symbol Parameter Min Typ Max Units Test Conditions VIN Input Operating Voltage 2.7 — 6.0 V Note 9 IOUTMAX Maximum Output Current 50 100 — — — — mA mA TC1072 TC1073 VOUT Output Voltage VR – 2.5% VR ±0.5% VR + 2.5% V Note 1 TCVOUT VOUT Temperature Coefficient — — 20 40 — — ppm/°C Note 2 ΔVOUT/ΔVIN Line Regulation — 0.05 0.35 %(VR + 1V) ≤ VIN ≤ 6V ΔVOUT/VOUT Load Regulation — 0.5 2.0 %IL = 0.1 mA to IOUTMAX (Note 3) VIN-VOUT Dropout Voltage — — — — 2 65 85 180 — — 120 250 mV IL =0.1 mA IL =20mA IL =50mA IL = 100 mA (Note 4), TC1073 IIN Supply Current — 50 80 µA SHDN =VIH, IL = 0 (Note 8) IINSD Shutdown Supply Current — 0.05 0.5 µA SHDN =0V PSRR Power Supply Rejection Ratio — 64 — dB FRE ≤ 1kHz IOUTSC Output Short Circuit Current — 300 450 mA VOUT =0V ΔVOUT/ΔPD Thermal Regulation — 0.04 — V/W Notes 5, 6 TSD Thermal Shutdown Die Temperature — 160 — °C ΔTSD Thermal Shutdown Hysteresis — 10 — °C eN Output Noise — 260 — nV/ √Hz IL =IOUTMAX 470 pF from Bypass to GND Note 1: VR is the regulator output voltage setting. For example: VR = 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V. 2: 3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value. 5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN =6V for T = 10 ms. 6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more details. 7: Hysteresis voltage is referenced by VR. 8: Apply for Junction Temperatures of -40°C to +85°C. 9: The minimum VIN has to justify the conditions = VIN ≥ VR +VDROPOUT and VIN ≥ 2.7V for IL = 0.1 mA to IOUTMAX. TC VOUT = (VOUTMAX – VOUTMIN) x 106 VOUT x ΔT |
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