công cụ tìm kiếm bảng dữ liệu linh kiện điện tử
  Vietnamese  ▼
ALLDATASHEET.VN

X  

CXXXXB500-SXX00-A bảng dữ liệu(PDF) 2 Page - Cree, Inc

tên linh kiện CXXXXB500-SXX00-A
Giải thích chi tiết về linh kiện  XBright짰 Power Chip LED
Download  4 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
nhà sản xuất  CREE [Cree, Inc]
Trang chủ  http://www.cree.com/
Logo CREE - Cree, Inc

CXXXXB500-SXX00-A bảng dữ liệu(HTML) 2 Page - Cree, Inc

  CXXXXB500-SXX00-A Datasheet HTML 1Page - Cree, Inc CXXXXB500-SXX00-A Datasheet HTML 2Page - Cree, Inc CXXXXB500-SXX00-A Datasheet HTML 3Page - Cree, Inc CXXXXB500-SXX00-A Datasheet HTML 4Page - Cree, Inc  
Zoom Inzoom in Zoom Outzoom out
 2 / 4 page
background image
Copyright © 2005-2006 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree,
the Cree logo, G•SiC and XBright are registered trademarks, and XB and XB500 are trademarks of Cree, Inc.

CPR3CS Rev. B
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
www.cree.com
Maximum Ratings at T
A = 5°C
Note 
CxxxXB500-Sxx00-A
DC Forward Current
150mANote 2
Peak Forward Current (1/10 duty cycle @ 1kHz)
200mA
LED Junction Temperature
125°C
Reverse Voltage
5 V
Operating Temperature Range
-40°C to +85°C
Storage Temperature Range
-40°C to +100°C
Electrostatic Discharge Threshold (HBM)Note 3
1000V
Electrostatic Discharge Classification (MIL-STD-883E)Note 3
Class 2
Typical Electrical/Optical Characteristics at T
A = 5°C, If = 5mA
Note 
Part Number
Forward Voltage (V
f, V)
Reverse Current
[I(Vr=5V), μA]
Full Width Half Max
(
λ
D, nm)
Min.
Typ.
Max.
Max.
Typ.
C460XB500-S3500-A
3.0
3.5
4.0
2
21
C470XB500-S3000-A
3.0
3.5
4.0
2
22
C505XB500-S2000-A
3.0
3.5
4.0
2
30
C527XB500-S1500-A
3.0
3.5
4.0
2
35
Mechanical Specifications
CxxxXB500-S000-A
Description
Dimension
Tolerance
P-N Junction Area (μm)
448 x 448
± 25
Top Area (μm)
325 x 325
± 25
Bottom Area (μm)
500 x 500
± 50
Chip Thickness (μm)
250
± 25
Au Bond Pad Diameter (μm)
120
± 10
Au Bond Pad Thickness (μm)
1.2
± 0.5
Back Contact Metal Area (μm)
376 x 376
± 25
Back Contact Metal Options/Thickness (μm)
1.7
± 0.3
Notes:
Maximum ratings are package dependent. The above ratings were determined using a Au-plated TO39 header without an encapsulant
for characterization. Ratings for other packages may differ. The junction temperature should be characterized in a specific package
to determine limitations. Assembly processing temperature must not exceed 325°C (< 5 seconds).
All Products conform to the listed minimum and maximum specifications for electrical and optical characteristics when assembled
and operated at 125 mA within the maximum ratings shown above. Efficiency decreases at higher currents. Typical values given are
within the range of average expected by manufacturer in large quantities and are provided for information only. All measurements
were made using a Au-plated TO39 header without an encapsulant. Optical characteristics measured in an integrating sphere using
Illuminance E.
Product resistance to electrostatic discharge (ESD) according to the HBM is measured by simulating ESD using a rapid avalanche
energy test (RAET). The RAET procedures are designed to approximate the maximum ESD ratings shown. The RAET procedure is
performed on each die. The ESD classification of Class 2 is based on sample testing according to MIL-STD-883E.
Back contact metal is 80%/20% Au/Sn by weight, with target eutectic melting temperature of approximately 282°C.
Caution: To avoid leakage currents and achieve maximum output efficiency, die attach material must not contact the side of the
chip.
XB500™ chips are shipped with the junction side up, requiring die transfer prior to die attach.
Specifications are subject to change without notice.
1.
2.
3.
4.
5.
6.
7.


Số phần tương tự - CXXXXB500-SXX00-A

nhà sản xuấttên linh kiệnbảng dữ liệuGiải thích chi tiết về linh kiện
logo
Cree, Inc
CXXXXB900-SX000-A CREE-CXXXXB900-SX000-A Datasheet
252Kb / 4P
   XBright짰 Power Chip LED
More results

Mô tả tương tự - CXXXXB500-SXX00-A

nhà sản xuấttên linh kiệnbảng dữ liệuGiải thích chi tiết về linh kiện
logo
Cree, Inc
CXXXXB900-SX000-A CREE-CXXXXB900-SX000-A Datasheet
252Kb / 4P
   XBright짰 Power Chip LED
logo
Roithner LaserTechnik G...
H2A1-H920 ROITHNER-H2A1-H920 Datasheet
255Kb / 4P
   High Power single chip LED
H2A1-H970 ROITHNER-H2A1-H970 Datasheet
269Kb / 4P
   High Power single chip LED
APG2C1-450 ROITHNER-APG2C1-450 Datasheet
163Kb / 4P
   High Power Single Chip LED
APG2C1-515 ROITHNER-APG2C1-515 Datasheet
306Kb / 4P
   High Power Single Chip LED
APG2C1-810 ROITHNER-APG2C1-810 Datasheet
314Kb / 4P
   High Power Single Chip LED
APG2C1-830 ROITHNER-APG2C1-830 Datasheet
319Kb / 4P
   High Power Single Chip LED
APG2C1-905 ROITHNER-APG2C1-905 Datasheet
319Kb / 4P
   High Power Single Chip LED
APG2C1-920 ROITHNER-APG2C1-920 Datasheet
318Kb / 4P
   High Power Single Chip LED
APG2C1-970 ROITHNER-APG2C1-970 Datasheet
332Kb / 4P
   High Power Single Chip LED
More results


Html Pages

1 2 3 4


bảng dữ liệu tải về

Go To PDF Page


Link URL




Chính sách bảo mật
ALLDATASHEET.VN
Cho đến nay ALLDATASHEET có giúp ích cho doanh nghiệp của bạn hay không?  [ DONATE ] 

Alldatasheet là   |   Quảng cáo   |   Liên lạc với chúng tôi   |   Chính sách bảo mật   |   Trao đổi link   |   Tìm kiếm theo nhà sản xuất
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com