 |
công cụ tìm kiếm bảng dữ liệu linh kiện điện tử |
|
|
công cụ tìm kiếm bảng dữ liệu linh kiện điện tử |
|
KMPC860TZQ50D4 bảng dữ liệu(PDF) 10 Page - Freescale Semiconductor, Inc |
|
||||||||||||||||||||||||||||||
KMPC860TZQ50D4 bảng dữ liệu(HTML) 10 Page - Freescale Semiconductor, Inc |
|
|
10 / 80 page  MPC860 Family Hardware Specifications, Rev. 7 10 Freescale Semiconductor Thermal Calculation and Measurement printed circuit board surrounding the device. This thermal model is most useful for ceramic packages with heat sinks where some 90% of the heat flows through the case and the heat sink to the ambient environment. For most packages, a better model is required. 7.3 Estimation with Junction-to-Board Thermal Resistance A simple package thermal model which has demonstrated reasonable accuracy (about 20%) is a two-resistor model consisting of a junction-to-board and a junction-to-case thermal resistance. The junction-to-case thermal resistance covers the situation where a heat sink is used or where a substantial amount of heat is dissipated from the top of the package. The junction-to-board thermal resistance describes the thermal performance when most of the heat is conducted to the printed circuit board. It has been observed that the thermal performance of most plastic packages, especially PBGA packages, is strongly dependent on the board temperature; see Figure 1. Figure 1. Effect of Board Temperature Rise on Thermal Behavior If the board temperature is known, an estimate of the junction temperature in the environment can be made using the following equation: TJ = TB + (RθJB × PD) where: RθJB = junction-to-board thermal resistance (ºC/W) TB = board temperature (ºC) PD = power dissipation in package If the board temperature is known and the heat loss from the package case to the air can be ignored, acceptable predictions of junction temperature can be made. For this method to work, the board and board mounting must be similar to the test board used to determine the junction-to-board thermal resistance, namely a 2s2p (board with a power and a ground plane) and by attaching the thermal balls to the ground plane. Board Temperature Rise Above Ambient Divided by Package Power |
Số phần tương tự - KMPC860TZQ50D4 |
|
Mô tả tương tự - KMPC860TZQ50D4 |
|
|
Link URL |
| Chính sách bảo mật |
| ALLDATASHEET.VN |
| Cho đến nay ALLDATASHEET có giúp ích cho doanh nghiệp của bạn hay không? [ DONATE ] |
Alldatasheet là | Quảng cáo | Liên lạc với chúng tôi | Chính sách bảo mật | Trao đổi link | Tìm kiếm theo nhà sản xuất All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
Vietnamese ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
