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MC33882EPR2 bảng dữ liệu(PDF) 7 Page - Freescale Semiconductor, Inc |
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MC33882EPR2 bảng dữ liệu(HTML) 7 Page - Freescale Semiconductor, Inc |
7 / 27 page Analog Integrated Circuit Device Data Freescale Semiconductor 7 33882 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 3. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Rating Symbol Value Limit ELECTRICAL RATINGS Load Supply Voltage Normal Operation (Steady-State) Transient Survival (1) VPWR(SS) VPWR(T) 25 -1.5 to 60 V Logic Supply Voltage (2) VDD -0.3 to 7.0 V Input Pin Voltage (3) VIN -0.3 to VDD + 0.3 V Output Clamp Voltage (OUT0 to OUT5) (4) 20 mA = IO = 0.2 A VO(OFF) 48 to 64 V Output Self-Limit Current OUT0 to OUT5 OUT6 and OUT7 IO(LIM) 3.0 to 6.0 0.05 to 0.15 A ESD Voltage (HSOP and QFN) Human Body Model (5) Machine Model (6) VESD1 VESD2 ±2000 ±200 V Output Clamp Energy (7) OUT0 to OUT5: Single Pulse at 1.5 A, TJ = 150°C OUT6 and OUT7: Single Pulse at 0.45 A, TJ = 150°C ECLAMP 100 50 mJ Maximum Operating Frequency (SPI) SO (8) fOF 3.2 MHz THERMAL RATINGS Storage Temperature TSTG -55 to 150 °C Operating Junction Temperature TJ -40 to 150 °C Peak Package Reflow Temperature During Reflow (9), (10) TPPRT Note 10. °C Notes 1. Transient capability with external 100 Ω resistor in series with V PWR pin and supply. 2. Exceeding these voltages may cause a malfunction or permanent damage to the device. 3. Exceeding the limits on any parallel inputs or SPI pins may cause permanent damage to the device. 4. With output OFF. 5. ESD1 testing is performed in accordance with the Human Body Model (CZAP=100 pF, RZAP=1500 Ω). 6. ESD2 testing is performed in accordance with the Machine Model (CZAP=200 pF, RZAP=0 Ω). 7. Maximum output clamp energy capability at indicated junction temperature using a single pulse method. 8. Serial Frequency Specifications assume the IC is driving 8 tri-stated devices (20 pF each). 9. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 10. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. |
Số phần tương tự - MC33882EPR2 |
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Mô tả tương tự - MC33882EPR2 |
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