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MC33794EK bảng dữ liệu(PDF) 6 Page - Freescale Semiconductor, Inc |
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MC33794EK bảng dữ liệu(HTML) 6 Page - Freescale Semiconductor, Inc |
6 / 18 page Sensors 6 Freescale Semiconductor MC33794 MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Rating Symbol Value Unit Peak VPWR Voltage VPWRPK 40 V Double Battery 1 Minute Maximum TA = 30°C VDBLBAT 26.5 V ESD Voltage Human Body Model (1) Machine Model (2) VESD1 VESD2 ±2000 ±200 V Storage Temperature TSTG -55 to 150 °C Operating Ambient Temperature TA -40 to 85 °C Operating Junction Temperature TJ -40 to 150 °C Thermal Resistance Junction-to-Ambient (3) Junction-to-Case (4) Junction-to-Board (5) RθJA RθJC RθJB 41 0.2 3.0 °C/W Lead Soldering Temperature (for 10 Seconds) TSOLDER 260 °C Notes 1. ESD1 performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω). 2. ESD2 performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω). 3. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. In accordance with SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal. 4. Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MILSPEC 883 Method 1012.1) with the cold plate temperature used for the case temperature. 5. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. |
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