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MC33486ADHR2 bảng dữ liệu(PDF) 4 Page - Freescale Semiconductor, Inc |
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MC33486ADHR2 bảng dữ liệu(HTML) 4 Page - Freescale Semiconductor, Inc |
4 / 30 page Analog Integrated Circuit Device Data 4 Freescale Semiconductor 33486A MAXIMUM RATINGS MAXIMUM RATINGS Table 2. MAXIMUM RATINGS All voltages are with respect to ground unless otherwise noted. Rating Symbol Value Unit Power Supply Voltage: Continuous/Pulse VBAT -0.3 to 40 V OUT1, OUT2 to VBAT Voltage: Continuous/Pulse VOUT -0.3 to 40 V IN1, IN2, WAKE, ST Input DC Voltage: Continuous/Pulse VIN -0.3 to 7.0 V IN1, IN2, WAKE Input Current IIN ±5.0 mA Output DC Output Current, 1 Channel ON, TA = 85°C (1) IOUTDC 10 A Output Current: Pulse (2) IOUTP Self-Limited A Operating Junction Temperature TJ -40 to 150 °C Operating Ambient Temperature TA -40 to 125 °C Storage Temperature TSTG -65 to 150 °C Thermal Resistance Junction to Case Junction to Ambient (1) RθJC RθJA 2.0 25 °C/W Power Dissipation at TCASE 140°C (3) PD 5.0 W ESD All Terminals Human Body Model (4) Machine Mode (5) VESD1 VESD2 ±2000 ±200 V Terminal Soldering Temperature (6) TSOLDER 240 °C Notes 1. Device mounted on dual-side printed circuit board with 70 µm copper thickness and 10 cm2 copper heatsink (2.5 cm2 on top side and 7.5 cm2 on down side). 2. See high-side output current shutdown, ILIM. 3. Assuming a 150 °C maximum junction temperature. 4. ESD1 testing is performed in accordance with the Human Body Model (CZAP= 100 pF, RZAP= 1500 Ω). 5. ESD2 testing is performed in accordance with the Machine Model (CZAP= 200 pF, RZAP= 0 Ω). 6. The maximum peak temperature during the soldering process should not exceed 235°C (+5.0°C/-0°C). The time within 5.0°C of actual peak temperature should range from 10 s to 30 s max. |
Số phần tương tự - MC33486ADHR2 |
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Mô tả tương tự - MC33486ADHR2 |
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