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MC33486ADHR2 bảng dữ liệu(PDF) 4 Page - Freescale Semiconductor, Inc

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Giải thích chi tiết về linh kiện  Dual High-Side Switch for H-Bridge Applications
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Analog Integrated Circuit Device Data
4
Freescale Semiconductor
33486A
MAXIMUM RATINGS
MAXIMUM RATINGS
Table 2. MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
Power Supply Voltage: Continuous/Pulse
VBAT
-0.3 to 40
V
OUT1, OUT2 to VBAT Voltage: Continuous/Pulse
VOUT
-0.3 to 40
V
IN1, IN2, WAKE, ST Input DC Voltage: Continuous/Pulse
VIN
-0.3 to 7.0
V
IN1, IN2, WAKE Input Current
IIN
±5.0
mA
Output DC Output Current, 1 Channel ON, TA = 85°C
(1)
IOUTDC
10
A
Output Current: Pulse (2)
IOUTP
Self-Limited
A
Operating Junction Temperature
TJ
-40 to 150
°C
Operating Ambient Temperature
TA
-40 to 125
°C
Storage Temperature
TSTG
-65 to 150
°C
Thermal Resistance
Junction to Case
Junction to Ambient (1)
RθJC
RθJA
2.0
25
°C/W
Power Dissipation at TCASE 140°C (3)
PD
5.0
W
ESD All Terminals
Human Body Model (4)
Machine Mode (5)
VESD1
VESD2
±2000
±200
V
Terminal Soldering Temperature (6)
TSOLDER
240
°C
Notes
1.
Device mounted on dual-side printed circuit board with 70
µm copper thickness and 10 cm2 copper heatsink (2.5 cm2 on top side and
7.5 cm2 on down side).
2.
See high-side output current shutdown, ILIM.
3.
Assuming a 150
°C maximum junction temperature.
4.
ESD1 testing is performed in accordance with the Human Body Model (CZAP= 100 pF, RZAP= 1500 Ω).
5.
ESD2 testing is performed in accordance with the Machine Model (CZAP= 200 pF, RZAP= 0 Ω).
6.
The maximum peak temperature during the soldering process should not exceed 235°C (+5.0°C/-0°C). The time within 5.0°C of actual
peak temperature should range from 10 s to 30 s max.


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