Analog Integrated Circuit Device Data

Freescale Semiconductor

5

33395

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. Maximum Ratings

All voltages are with respect to ground unless otherwise noted.

Rating

Symbol

Value

Unit

VIGN Supply Voltage

-15.5 to 40

VDC

VIGNP Load Dump Survival

V

IGNPLD

-0.3 to 65

VDC

VDD Logic Supply Voltage (Fail Safe)

-0.3 to 7.0

VDC

Logic Input Voltage (LSEn, HSEn, PWM, and MODEn)

0.3 to 7.0

VDC

100

mA

ESD Voltage (1)

Human Body Model

Machine Model

±500

±200

V

Storage Temperature

-65 to 160

°C

Operating Ambient Temperature

-40 to 125

°C

Operating Case Temperature

-40 to 125

°C

Maximum Junction Temperature

150

°C

1.5

W

Peak Package Reflow Temperature During Reflow (2), (3)

Note 3

°C

Thermal Resistance, Junction-to-Ambient

65

°C/W

Notes

1.

2.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

3.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL),

Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.

MC33xxxD enter 33xxx), and review parametrics.