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MCZ33291EGR2 bảng dữ liệu(PDF) 4 Page - Freescale Semiconductor, Inc

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MCZ33291EGR2 bảng dữ liệu(HTML) 4 Page - Freescale Semiconductor, Inc

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Analog Integrated Circuit Device Data
4
Freescale Semiconductor
33291
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating
Symbol
Value
Unit
Power Supply Voltage
Normal Operation (Steady-State)
Transient Conditions (12)
VPWR(SUS)
VPWR(PK)
-1.5 to 26.5
-13 to 60
V
Logic Supply Voltage (2)
VDD
-0.3 to 7.0
V
Input Pin Voltage (3)
VIN
-0.3 to 7.0
V
Output Clamp Voltage (4)
5.0 mA
≤ I
OUT ≤ 0.5 A
VOUT(OFF)
45 to 65
V
Output Self-Limit Current
IOUT(LIM)
1.0 to 3.0
A
Continuous Per Output Current (4), (5)
IOUT(CONT)
500
mA
ESD Voltage (6)
Human Body Model (7)
Machine Model (7)
VESD1
VESD2
±2000
±200
V
Output Clamp Energy (8)
ECLAMP
50
mJ
Recommended Frequency of SPI Operation
fSPI
3.0
MHz
Storage Temperature
TSTG
-55 to 150
°C
Operating Case Temperature
TC
-40 to 125
°C
Operating Junction Temperature
TJ
-40 to 150
°C
Power Dissipation (
TA = 25°C)
(9)
PD
2.0
W
Peak Package Reflow Temperature During Reflow (10), (11)
TPPRT
Note 11.
°C
Notes
1.
Transient capability with external 100
Ω resistor in series with V
PWR pin and supply.
2.
Exceeding these limits may cause a malfunction or permanent damage to the device.
3.
Exceeding the limits on SCLK, SI, CS, SFPD, or RST pins may cause permanent damage to the device.
4.
With output OFF.
5.
Continuous output current rating so long as maximum junction temperature is not exceeded. Operation at 125
°C ambient temperature
will require maximum output current computation using package RθJA.
6.
ESD data available upon request.
7.
ESD1 testing is performed in accordance with the Human Body Model (CZAP = 200 pF, RZAP = 1500 Ω), ESD2 testing is performed in
accordance with the Machine Model (CZAP = 200pF, RZAP = 0 Ω).
8.
Maximum output clamp energy capability at 150
°C junction temperature using a single non-repetitive pulse method.
9.
Maximum power dissipation at indicated junction temperature with no heat sink used.
10.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
11.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.


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