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FSTUD16211MTD bảng dữ liệu(PDF) 1 Page - Fairchild Semiconductor |
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1 / 8 page © 2001 Fairchild Semiconductor Corporation DS500390 www.fairchildsemi.com June 2000 Revised October 2006 FSTUD16211 24-Bit Bus Switch with −2V Undershoot Protection and Level Shifting General Description The Fairchild Switch FSTUD16211 provides 24-bits of high-speed CMOS TTL-compatible bus switching. The low on resistance of the switch allows inputs to be connected to outputs without adding propagation delay or generating additional ground bounce noise. A diode to VCC has been integrated into the circuit to allow for level shifting between 5V inputs and 3.3V outputs. The device is organized as a 12-bit or 24-bit bus switch. When OE1 is LOW, the switch is ON and Port 1A is con- nected to Port 1B. When OE2 is LOW, Port 2A is connected to Port 2B. When OE1/2 is HIGH, a high impedance state exists between the A and B Ports. The A and B Ports have “undershoot hardened” circuit protection to support an extended range to 2.0V below ground. Fairchild’s inte- grated Undershoot Hardened Circuit (UHC®) senses undershoot at the I/O’s, and responds by preventing volt- age differentials from developing and turning on the switch. Features s Undershoot hardened to −2V (A and B Ports) s Voltage level shifting s 4 Ω switch connection between two ports s Minimal propagation delay through the switch s Low lCC s Zero bounce in flow-through mode s Control inputs compatible with TTL level s See Applications Note AN-5008 for details s Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA) (Preliminary) Ordering Code: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Note 1: BGA package available in Tape and Reel only. Logic Diagram UHC® is a registered trademark of Fairchild Semiconductor Corporation. Order Number Package Number Package Description FSTUD16211GX (Note 1) BGA54A (Preliminary) 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide [TAPE and REEL] FSTUD16211MTD MTD56 56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide |
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