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AM29DL16XDT120VRF bảng dữ liệu(PDF) 5 Page - Advanced Micro Devices |
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AM29DL16XDT120VRF bảng dữ liệu(HTML) 5 Page - Advanced Micro Devices |
5 / 57 page ![]() December 1, 2006 21533E5 Am29DL16xD 7 D A TA SH EET TABLE OF CONTENTS Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 6 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 7 Special Package Handling Instructions .......................................... 9 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Ordering Information . . . . . . . . . . . . . . . . . . . . . . 11 Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 12 Table 1. Am29DL16xD Device Bus Operations ....................................12 Word/Byte Configuration .............................................................. 12 Requirements for Reading Array Data ......................................... 12 Writing Commands/Command Sequences .................................. 13 Accelerated Program Operation ............................................... 13 Autoselect Functions ................................................................. 13 Simultaneous Read/Write Operations with Zero Latency ............ 13 Standby Mode .............................................................................. 13 Automatic Sleep Mode ................................................................. 13 RESET#: Hardware Reset Pin ..................................................... 14 Output Disable Mode ................................................................... 14 Table 2. Am29DL16xD Device Bank Divisions .....................................14 Table 3. Sector Addresses for Top Boot Sector Devices ......................15 Table 4. Secured Silicon ™ Sector Addresses for Top Boot Devices... 15 Table 5. Sector Addresses for Bottom Boot Sector Devices .................16 Table 6. Secured Silicon ™ Addresses for Bottom Boot Devices......... 16 Autoselect Mode .......................................................................... 17 Table 7. Am29DL16xD Autoselect Codes, (High Voltage Method) ......17 Sector/Sector Block Protection and Unprotection ........................ 18 Table 8. Top Boot Sector/Sector Block Addresses for Protection/Unprotection ...................................................................18 Table 9. Bottom Boot Sector/Sector Block Addresses for Protection/Unprotection ...................................................................18 Write Protect (WP#) ..................................................................... 19 Temporary Sector/Sector Block Unprotect ................................... 19 Figure 1. Temporary Sector Unprotect Operation................................. 19 Figure 2. In-System Sector/Sector Block Protection and Unprotection Algorithms........................................................................ 20 Secured Silicon Sector Flash Memory Region ............................. 21 Factory Locked: Secured Silicon Sector Programmed and Protected At the Factory ........................................................... 21 Customer Lockable: Secured Silicon Sector NOT Programmed or Protected At the Factory ........................................................... 21 Hardware Data Protection ............................................................ 21 Low VCC Write Inhibit ............................................................... 22 Write Pulse “Glitch” Protection .................................................. 22 Logical Inhibit ............................................................................ 22 Power-Up Write Inhibit .............................................................. 22 Common Flash Memory Interface (CFI) . . . . . . . 22 Table 10. CFI Query Identification String .............................................. 22 Table 11. System Interface String......................................................... 23 Table 12. Device Geometry Definition .................................................. 23 Table 13. Primary Vendor-Specific Extended Query ............................ 24 Command Definitions . . . . . . . . . . . . . . . . . . . . . . 25 Reading Array Data ...................................................................... 25 Reset Command .......................................................................... 25 Autoselect Command Sequence .................................................. 25 Enter Secured Silicon ™ Sector/Exit Secured Silicon Sector Com- mand Sequence ........................................................................... 26 Byte/Word Program Command Sequence ................................... 26 Unlock Bypass Command Sequence ....................................... 26 Figure 3. Program Operation ................................................................ 27 Chip Erase Command Sequence ................................................. 27 Sector Erase Command Sequence .............................................. 27 Erase Suspend/Erase Resume Commands ................................ 28 Figure 4. Erase Operation .................................................................... 28 Command Definitions ................................................................... 29 Table 14. Am29DL16xD Command Definitions .................................... 29 Write Operation Status . . . . . . . . . . . . . . . . . . . . 30 DQ7: Data# Polling ...................................................................... 30 Figure 5. Data# Polling Algorithm ......................................................... 30 RY/BY#: Ready/Busy# ................................................................. 31 DQ6: Toggle Bit I .......................................................................... 31 Figure 6. Toggle Bit Algorithm .............................................................. 31 DQ2: Toggle Bit II ......................................................................... 32 Reading Toggle Bits DQ6/DQ2 .................................................... 32 DQ5: Exceeded Timing Limits ...................................................... 32 DQ3: Sector Erase Timer ............................................................. 32 Table 15. Write Operation Status ......................................................... 33 Absolute Maximum Ratings . . . . . . . . . . . . . . . . 34 Figure 7. Maximum Negative Overshoot Waveform............................. 34 Figure 8. Maximum Positive Overshoot Waveform ............................. 34 Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 34 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 35 Figure 9. ICC1 Current vs. Time (Showing Active and Automatic Sleep Currents)..................................................................................... 36 Figure 10. Typical ICC1 vs. Frequency................................................... 36 Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Figure 11. Test Setup .......................................................................... 37 Table 16. Test Specifications ................................................................ 37 Key To Switching Waveforms ...................................................... 37 Figure 12. Input Waveforms and Measurement Levels ........................ 37 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38 Figure 13. Read Operation Timings...................................................... 38 Figure 14. Reset Timings...................................................................... 39 Word/Byte Configuration (BYTE#) ............................................... 40 Figure 15. BYTE# Timings for Read Operations .................................. 40 Figure 16. BYTE# Timings for Write Operations .................................. 40 Erase and Program Operations ................................................... 41 Figure 17. Program Operation Timings ................................................ 42 Figure 18. Accelerated Program Timing Diagram ................................ 42 Figure 19. Chip/Sector Erase Operation Timings ................................. 43 Figure 20. Back-to-back Read/Write Cycle Timings ............................. 44 Figure 21. Data# Polling Timings (During Embedded Algorithms) ....... 44 Figure 22. Toggle Bit Timings (During Embedded Algorithms) ............ 45 Figure 23. DQ2 vs. DQ6 ....................................................................... 45 Temporary Sector/Sector Block Unprotect ................................... 46 Figure 24. Temporary Sector/Sector Block Unprotect Timing Diagram 46 Figure 25. Sector/Sector Block Protect and Unprotect Timing Diagram 47 Alternate CE# Controlled Erase and Program Operations ........... 48 Figure 26. Alternate CE# Controlled Write (Erase/Program) Operation Timings ................................................................................ 49 Erase And Programming Performance . . . . . . . 50 Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 50 Package and Pin Capacitance . . . . . . . . . . . . . . . 50 Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 FBC048—48-Ball Fine-Pitch Ball Grid Array 8 x 9 mm package ........................................................................ 51 LAA064—64-Ball Fortified Ball Grid Array, 13 x 11 mm package .................................................................... 52 TS 048—48-Pin Standard TSOP ................................................. 53 VBF048—48-Ball Very Thin Profile Fine-Pitch Ball Grid Array .... 54 Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 55 |
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