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NBSG53A bảng dữ liệu(PDF) 4 Page - ON Semiconductor |
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4 / 18 page NBSG53A http://onsemi.com 4 Table 5. ATTRIBUTES Characteristics Value Positive Operating Voltage Range for VCC (VEE = 0 V) 2.375 V to 3.465 V Negative Operating Voltage Range for VEE (VCC = 0 V) −2.375 V to −3.465 V Internal Input Pulldown Resistor (R, SEL) 75 k W ESD Protection Human Body Model Machine Model Charged Device Model > 1.5 kV > 50 V > 4 kV Moisture Sensitivity (Note 5) 16−FCBGA 16−QFN Level 3 Level 1 Flammability Rating UL 94 V−0 @ 0.125 in Oxygen Index 28 to 34 Transistor Count 482 Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 5. For additional information, refer to Application Note AND8003/D. Table 6. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Units VCC Positive Power Supply VEE = 0 V 3.6 V VEE Negative Power Supply VCC = 0 V −3.6 V VI Positive Input Negative Input VEE = 0 V VCC = 0 V VI v VCC VI w VEE 3.6 −3.6 V V VINPP Differential Input Voltage |D − D| VCC − VEE w 2.8 V VCC − VEE < 2.8 V 2.8 |VCC − VEE| V V IIN Input Current Through RT (50 W Resistor) Static Surge 45 80 mA mA IOUT Output Current Continuous Surge 25 50 mA mA TA Operating Temperature Range 16 FCBGA 16 QFN −40 to +70 −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) (Note 6) 0 LFPM 500 LFPM 0 LFPM 500 LFPM 16 FCBGA 16 FCBGA 16 QFN 16 QFN 108 86 41.6 35.2 °C/W °C/W °C/W °C/W qJC Thermal Resistance (Junction−to−Case) 2S2P (Note 6) 2S2P (Note 7) 16 FCBGA 16 QFN 5.0 4.0 °C/W °C/W Tsol Wave Solder Pb (BGA) Pb (QFN) Pb−Free (QFN) < 15 sec < 3 sec @ 248 °C < 3 sec @ 260 °C 225 265 265 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 6. JEDEC standard 51−6, multilayer board − 2S2P (2 signal, 2 power). 7. JEDEC standard multilayer board − 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad. |
Số phần tương tự - NBSG53A_06 |
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Mô tả tương tự - NBSG53A_06 |
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