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NBSG16 bảng dữ liệu(PDF) 4 Page - ON Semiconductor

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Giải thích chi tiết về linh kiện  2.5V/3.3V SiGe Differential Receiver/Driver with RSECL Outputs
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Table 4. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
Positive Power Supply
VEE = 0 V
3.6
V
VEE
Negative Power Supply
VCC = 0 V
−3.6
V
VI
Positive Input
Negative Input
VEE = 0 V
VCC = 0 V
VI  VCC
VI  VEE
3.6
−3.6
V
V
VINPP
Differential Input Voltage
|D − D|
VCC − VEE w 2.8 V
VCC − VEE <
2.8 V
2.8
|VCC − VEE|
V
V
Iout
Output Current
Continuous
Surge
25
50
mA
mA
IBB
VBB Sink/Source
1
mA
IMM
VMM Sink/Source
1
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient)
(Note 2)
0 LFPM
500 LFPM
0 LFPM
500 LFPM
16 FCBGA
16 FCBGA
16 QFN
16 QFN
108
86
41.6
35.2
°C/W
°C/W
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
1S2P (Note 2)
2S2P (Note 3)
16 FCBGA
16 QFN
5
4.0
°C/W
°C/W
Tsol
Wave Solder
Pb
Pb−Free
225
225
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. JEDEC standard multilayer board − 1S2P (1 signal, 2 power)
3. JEDEC standard multilayer board − 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad.


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