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MC33765DTBG bảng dữ liệu(PDF) 8 Page - ON Semiconductor |
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MC33765DTBG bảng dữ liệu(HTML) 8 Page - ON Semiconductor |
8 / 12 page MC33765 http://onsemi.com 8 DEFINITIONS Load Regulation − The change in output voltage for a change in load current at constant chip temperature. Dropout Voltage − The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100 mV below its nominal value (which is measured at 1.0 V differential input/output), dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Output Noise Voltage − The RMS AC voltage at the output with a constant load and no input ripple, measured over a specified frequency range. 10 100 10000 0 100 Frequency (Hz) 1000 150 50 300 OUT1, 2, 3, 4, 5 200 250 100000 1000000 OUT3 MC33765 Output noise performances Vin = 3.6V Iout = typical Cbyp = 10nF Maximum Power Dissipation − The maximum total dissipation for which the regulator will operate within specifications. Quiescent Current − Current which is used to operate the regulator chip with no load current. Line Regulation − The change in input voltage for a change in the input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Thermal Protection − Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated, typically 160 °C, the regulator turns off. This feature is provided to prevent catastrophic failures from accidental overheating. Maximum Package Power Dissipation and RMS Current − The maximum package power dissipation is the power dissipation level at which the junction temperature reaches its maximum value i.e. 125 °C. The junction temperature is rising while the difference between the input power (VCC X ICC) and the output power (Vout X Iout) is increasing. As MC33765 device exhibits five independent outputs Iout is specified as the maximum RMS current combination of the five output currents. As the device can be switched ON/OFF through independent Enable (ON/OFF pin) or Common Enable, the output signal could be, for example, a square wave. Let’s assume that the device is ON during TON on a signal period T. The RMS current will be given by: I out RMS + I P D D + T ON T where Ton Ip T, period Depending on ambient temperature, it is possible to calculate the maximum power dissipation and so the maximum RMS current as following: Pd + T J –T A RqJA The maximum operating junction temperature TJ is specified at 125 °C, if TA = 25°C, then PD = 700 mW. By neglecting the quiescent current, the maximum power dissipation can be expressed as: Iout + P D V CC –Vout So that in the more drastic conditions: VCC = 5.3 V, Vout = 2.7 V then the maximum RMS value of Iout is 269 mA. The maximum power dissipation supported by the device is a lot increased when using appropriate application design. Mounting pad configuration on the PCB, the board material and also the ambient temperature are affected the rate of temperature rise. It means that when the IC has good thermal conductivity through PCB, the junction temperature will be “low” even if the power dissipation is great. The thermal resistance of the whole circuit can be evaluated by deliberately activating the thermal shutdown of the circuit (by increasing the output current or raising the input voltage for example). Then you can calculate the power dissipation by subtracting the output power from the input power. All variables are then well known: power dissipation, thermal shutdown temperature (160 °C for MC33765) and ambient temperature. RqJA + T J –T A P D |
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