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MC33560 bảng dữ liệu(PDF) 4 Page - ON Semiconductor

tên linh kiện MC33560
Giải thích chi tiết về linh kiện  Power Management and Interface IC for Smartcard Readers and Couplers
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MC33560
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4
ELECTRICAL CHARACTERISTICS (continued) These specifications are written in the same style as common for standard
integrated circuits. The convention considers current flowing into the pin (sink current) as positive and current flowing out of the pin
(source current) as negative. (Conditions: VBAT = 4.0 V, VCC = 5.0 V nom, PWRON = VBAT , Operating Mode, −ICC = 10 mA, −25°C ≤ TA
≤ 85°C, L1 = 47 mH, RLIM = 0 W, CRDVCC capacitor = 10 mF, unless otherwise noted.)
Characteristic
Unit
Max
Typ
Min
Symbol
Test Conditions
APPLICATION INTERFACE DC SECTION (VBAT = 5.0 V)
Input High Threshold Voltage
(increasing)
Pins 2, 4, 5, 6, 10, 17
VIH
0.55*VBAT
0.65*VBAT
V
Input Low Threshold Voltage
(decreasing)
Pins 2, 5, 6, 10
Pin 17
Pin 4
VIL
0.3*VBAT
0.2*VBAT
0.3*VBAT
0.45*VBAT
0.40*VBAT
0.5*VBAT
V
Switching Hysteresis
Pins 2, 4, 5, 6, 10, 17
VHYST
0.06*VBAT
0.3*VBAT
V
Threshold Voltage
Pin 9
Pin 18
VTH
0.5*VBAT
0.4*VBAT
0.6*VBAT
0.6*VBAT
V
Pulldown resistance
VIN = VBAT − 1.0 V, Pins 2, 6, 7, 10
Rdown
120
240
500
k
W
Pullup resistance
VIN = 0.5 V, Pin 3, 4, 5
Rup
120
240
500
k
W
Output High Voltage
IOH = −2.5 mA, Pin 3, Pin 4 for CS = H
IOH = −50 mA, pins 7, 20,21
IOH = −0.2 mA, Pin 8
Pin 4 ( in Output Mode)
VOH
VBAT − 1
V
Output Low Voltage
IOL = 1.0 mA, Pins 7, 20, 21
IOL = 0.2 mA, Pins 3, 4, 8
VOL
0.4
V
Input Leakage Current
VIN = 2.5 V, CS = H,
Pins 9, 17, 18, 20, 21
±Ileak
2.0
mA
CARD INTERFACE DC SECTION (VBAT = 5.0 V)
Output High Voltage
IOH = −20 mA, Pins 11, 16, 19
IOL = 0.2 mA, Pins 14, 15
VOH
VCC − 0.9
V
Output Low Voltage
IOL = 1.0 mA, Pins 11, 16, 19
IOL = 0.2 mA, Pins 14, 15
VOL
0.4
V
I/O Pullup Resistance, Operating
Mode, CS =L , PWRON = H
VOL = 0.5 V, Pins 11, 16, 19
18
k
W
Card pins security voltage
(Card access deactivated)
PWRON = GND, lin = 10 mA,
Pins 11, 14, 15, 16, 19
Vsecurity
2.0
V
DIGITAL DYNAMIC SECTION (VBAT = 5.0 V, Normal Operating Mode) (Note 6)
Input Clock Frequency
Pin 9, Duty Cycle = 50%
fasyclk
20
MHz
Card Clock Frequency
Pin 15
fcrdclk
20
MHz
Card Clock Duty Cycle (Note 7)
Pin 15, 50% to 50% VCC,
fio = 16 MHz
rclk
45
55
%
Card Clock Rise and Fall Time
Pin 15, 10%
↔ 90% VCC
trclk, tfclk
10
ns
I/O Data Transfer Frequency
Pin [7, 11], [21, 16], [20, 19] (Note 8)
fio
1.0
MHz
I/O Duty Cycle
Pin [7, 11], [21, 16], [20, 19] (Note 8)
50% to 50% VCC
rio
45
55
%
I/O Rise and Fall Time
Pin [7, 11], [21, 16], [20, 19] (Note 8)
10%
↔ 90% VCC
trio, tfio
150
ns
I/O Transfer Time
Pin [7, 11], [21, 16], [20, 19] (Note 8)
50% to 50% VCC, L → H, H → L
ttr
100
ns
Card Signal Sequence Interval
Pins 11, 14, 15, 16, 19
VCC Powerup / Powerdown
tdseq
0.2
1.0
ms
4. See Figures 2 and 3.
5. The transistors T1 on lines IO, C4 and C8 (see Figure 24) have a max Rdson of 250 W.
6. Pin loading = 30 pF, except INVOUT = 15 pF.
7. As the clock buffer is optimized for low power consumption and hence not symmetrical, clock signal duty cycle is guaranteed for divide
by 2 and divide by 4 ratio.
8. In either direction.


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