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MC33275MN-3.0R2G bảng dữ liệu(PDF) 2 Page - ON Semiconductor |
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2 / 15 page MC33275, NCV33275 http://onsemi.com 2 PIN CONNECTIONS GND Vin Vout 4 12 3 GND GND Vin Vout 4 12 3 GND Input GND GND N/C Output GND GND N/C Pins 4 and 5 Not Connected MC33275ST 1 2 3 4 8 7 6 5 MC33275D MC33275DT 4 3 2 1 5 6 7 8 Input Input Input N/C Output N/C GND N/C MC33275MN MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage VCC 13 Vdc Power Dissipation and Thermal Characteristics TA = 25°C Maximum Power Dissipation Case 751 (SOIC−8) D Suffix Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Case Case 318E (SOT−223) ST Suffix Thermal Resistance, Junction−to−Air Thermal Resistance, Junction−to−Case Case 369A (DPAK−3) DT Suffix Thermal Resistance, Junction−to−Air Thermal Resistance, Junction−to−Case Case 488AF (DFN−8, 4x4) MN Suffix Thermal Resistance, Junction−to−Air (with 1.0 oz PCB cu area) Thermal Resistance, Junction−to−Air (with 1.8 oz PCB cu area) Thermal Resistance, Junction−to−Case PD RqJA RqJC RqJA RqJC RqJA RqJC RqJA RqJA psi−JC* Internally Limited 160 25 245 15 92 6.0 183 93 9.0 W °C/W °C/W °C/W °C/W °C/W °C/W °C/W °C/W °C/W Output Current IO 300 mA Maximum Junction Temperature TJ 150 °C Operating Ambient Temperature Range TA − 40 to +125 °C Storage Temperature Range Tstg − 65 to +150 °C Electrostatic Discharge Sensitivity (ESD) Human Body Model (HBM) Machine Model (MM) ESD 4000 400 V Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. *“C’’ (“case’’) is defined as the solder−attach interface between the center of the exposed pad on the bottom of the package, and the board to which it is attached. |
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