NUP2201MR6

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6

PACKAGE DIMENSIONS

TSOP−6

CASE 318G−02

ISSUE K

23

4

5

6

A

L

1

S

G

D

B

H

C

0.05 (0.002)

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

0.1142 0.1220

2.90

3.10

B

0.0512 0.0669

1.30

1.70

C

0.0354 0.0433

0.90

1.10

D

0.0098 0.0197

0.25

0.50

G

0.0335 0.0413

0.85

1.05

H

0.0005 0.0040

0.013

0.100

J

0.0040 0.0102

0.10

0.26

K

0.0079 0.0236

0.20

0.60

L

0.0493 0.0610

1.25

1.55

M

0

10

0

10

S

0.0985 0.1181

2.50

3.00

__

_

_

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. MAXIMUM LEAD THICKNESS INCLUDES

LEAD FINISH THICKNESS. MINIMUM LEAD

THICKNESS IS THE MINIMUM THICKNESS

OF BASE MATERIAL.

4. DIMENSIONS A AND B DO NOT INCLUDE

MOLD FLASH, PROTRUSIONS, OR GATE

BURRS.

M

J

K

0.95

0.037

1.9

0.075

0.95

0.037

1.0

0.039

Figure 5. TSOP−6

2.4

0.094

0.7

0.028

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

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