MC74VHCU04

http://onsemi.com

2

Figure 2. Pinout: 14−Lead Packages

13

14

12

11

10

9

8

2

1

3

4

567

A6

Y6

A5

Y5

A4

Y4

A1

Y1

A2

Y2

A3

Y3

GND

(Top View)

MAXIMUM RATINGS

Symbol

Parameter

Value

Unit

DC Supply Voltage

–0.5 to + 7.0

V

DC Input Voltage

–0.5 to + 7.0

V

DC Output Voltage

V

Input Diode Current

−20

mA

Output Diode Current

± 20

mA

DC Output Current, per Pin

± 25

mA

± 50

mA

Power Dissipation in Still Air,

SOIC Packages†

TSSOP Package†

500

450

mW

Storage Temperature

– 65 to + 150

_C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress

ratings only. Functional operation above the Recommended Operating Conditions is not implied.

Extended exposure to stresses above the Recommended Operating Conditions may affect device

reliability.

†Derating — SOIC Packages: – 7 mW/_C from 65_ to 125_C

TSSOP Package: − 6.1 mW/_C from 65_ to 125_C

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min

Max

Unit

DC Supply Voltage

2.0

5.5

V

DC Input Voltage

0

5.5

V

DC Output Voltage

0

V

Operating Temperature

−40

+ 85

_C

This device contains protection

circuitry to guard against damage

due to high static voltages or electric

fields. However, precautions must

be taken to avoid applications of any

voltage higher than maximum rated

voltages to this high−impedance cir-

Unused inputs must always be

tied to an appropriate logic voltage

Unused outputs must be left open.