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5 / 8 page MC74LVX139 http://onsemi.com 5 *Includes all probe and jig capacitance Figure 8. Test Circuit CL* TEST POINT DEVICE UNDER TEST OUTPUT ORDERING INFORMATION Device Package Shipping† MC74LVX139DR2 SOIC−16 2500 Tape & Reel MC74LVX139DR2G SOIC−16 (Pb−Free) 2500 Tape & Reel MC74LVX139DTR2 TSSOP−16* 2500 Tape & Reel MC74LVX139M SOEIAJ−16 50 Units / Rail MC74LVX139MG SOEIAJ−16 (Pb−Free) 50 Units / Rail MC74LVX139MEL SOEIAJ−16 2000 Tape & Reel MC74LVX139MELG SOEIAJ−16 (Pb−Free) 2000 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. EMBOSSED CARRIER DIMENSIONS (See Notes 6 and 7) Tape Size B1 Max D D1 E F K P P0 P2 R T W 8 mm 4.35 mm (0.179”) 1.5 mm + 0.1 −0.0 (0.059” 0 004 1.0 mm Min (0.179”) 1.75 mm ±0.1 (0.069 ±0.004”) 3.5 mm ±0.5 (1.38 ±0.002”) 2.4 mm Max (0.094”) 4.0 mm ±0.10 (0.157 ±0.004”) 4.0 mm ±0.1 (0.157 ±0.004”) 2.0 mm ±0.1 (0.079 ±0.004”) 25 mm (0.98”) 0.6 mm (0.024) 8.3 mm (0.327) 12 mm 8.2 mm (0.323”) ( +0.004 −0.0) 1.5 mm Min (0.060) ) 5.5 mm ±0.5 (0.217 ±0.002”) 6.4 mm Max (0.252”) 4.0 mm ±0.10 (0.157 ±0.004”) 8.0 mm ±0.10 (0.315 ±0.004”) ) ) 30 mm (1.18”) 12.0 mm ±0.3 (0.470 ±0.012”) 16 mm 12.1 mm (0.476”) 7.5 mm ±0.10 (0.295 ±0.004”) 7.9 mm Max (0.311”) 4.0 mm ±0.10 (0.157 ±0.004”) 8.0 mm ±0.10 (0.315 ±0.004”) 12.0 mm ±0.10 (0.472 ±0.004”) 16.3 mm (0.642) 24 mm 20.1 mm (0.791”) 11.5 mm ±0.10 (0.453 ±0.004”) 11.9 mm Max (0.468”) 16.0 mm ±0.10 (0.63 ±0.004”) 24.3 mm (0.957) 6. Metric Dimensions Govern−English are in parentheses for reference only. 7. A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min to 0.50 mm max. The component cannot rotate more than 10 ° within the determined cavity |
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