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2 / 7 page MCR12DSM, MCR12DSN http://onsemi.com 2 THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Thermal Resistance,− Junction−to−Case Thermal Resistance − Junction−to−Ambient Thermal Resistance − Junction−to−Ambient (Note 2) RqJC RqJA RqJA 2.2 88 80 °C/W Maximum Lead Temperature for Soldering Purposes (Note 3) TL 260 °C ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Characteristics Symbol Min Typ Max Unit OFF CHARACTERISTICS Peak Repetitive Forward or Reverse Blocking Current (Note 4) (VAK = Rated VDRM or VRRM; RGK = 1.0 KW)TJ = 25°C TJ = 110°C IDRM, IRRM − − − − 10 500 mA ON CHARACTERISTICS Peak Reverse Gate Blocking Voltage, (IGR = 10 mA) VGRM 10 12.5 18 V Peak Reverse Gate Blocking Current, (VGR = 10 V) IGRM − − 1.2 mA Peak Forward On−State Voltage (Note 5), (ITM = 20 A) VTM − 1.3 1.9 V Gate Trigger Current (Continuous dc) (Note 6) (VD = 12 V, RL = 100 W)TJ = 25°C TJ = −40°C IGT 5.0 − 12 − 200 300 mA Gate Trigger Voltage (Continuous dc) (Note 6) (VD = 12 V, RL = 100 W)TJ = 25°C TJ = −40°C TJ = 110°C VGT 0.45 − 0.2 0.65 − − 1.0 1.5 − V Holding Current (VD = 12 V, Initiating Current = 200 mA, Gate Open) TJ = 25°C TJ = −40°C IH 0.5 − 1.0 − 6.0 10 mA Latching Current (VD = 12 V, IG = 2.0 mA) TJ = 25°C TJ = −40°C IL 0.5 − 1.0 − 6.0 10 mA Turn−On Time (Source Voltage = 12 V, RS = 6.0 KW, IT = 16 A(pk), RGK = 1.0 KW) (VD = Rated VDRM, Rise Time = 20 ns, Pulse Width = 10 ms) tgt − 2.0 5.0 ms DYNAMIC CHARACTERISTICS Critical Rate of Rise of Off−State Voltage (VD = 0.67 x Rated VDRM, Exponential Waveform, RGK = 1.0 KW, TJ = 110°C) dv/dt 2.0 10 − V/ ms 2. These ratings are applicable when surface mounted on the minimum pad sizes recommended. 3. 1/8 ″ from case for 10 seconds. 4. Ratings apply for negative gate voltage or RGK = 1.0 kW. Devices shall not have a positive gate voltage concurrently with a negative voltage on the anode. Devices should not be tested with a constant current source for forward and reverse blocking capability such that the voltage applied exceeds the rated blocking voltage. 5. Pulse Test: Pulse Width ≤ 2.0 msec, Duty Cycle ≤ 2%. 6. RGK current not included in measurement. |
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Mô tả tương tự - MCR12DSN-001 |
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