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LM317CM bảng dữ liệu(PDF) 2 Page - Vishay Siliconix |
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LM317CM bảng dữ liệu(HTML) 2 Page - Vishay Siliconix |
2 / 6 page Part Number Vishay Semiconductor www.vishay.com Document Number 74809 2 29-Nov-01 Electrical Characteristics – LM317 Vi -Vo =5V, Io = 0.5A, TJ = Tlow to Thigh (see Note 1), Imax and Pmax per Note 2, unless otherwise noted. Parameter Symbol Conditions Min. Typ. Max. Unit Line Regulation (Fig. 1)(3) REGline TA = 25°C – 0.01 0.04 %Vo/V 3.0V ≤ VI – Vo ≤ 40V TJ = 0°C thru 125°C – 0.02 0.07 Load Regulation (Fig. 2)(3) REGload Vo ≤ 5.0 – 525 mV TJ = 25°C, 10mA ≤ Io ≤ 1.5A Vo ≥ 5.0 – 0.1 0.5 %Vo Load Regulation (Fig. 2)(3) REGload Vo ≤ 5.0 – 20 70 mV 10mA ≤ Io ≤ 1.5A Vo ≥ 5.0 – 0.3 1.5 %Vo Thermal Regulation REGtherm TJ = 25°C, 20ms Pulse – 0.03 0.07 %Vo/W Adjustment Pin Current (Fig. 3) IAdj – 50 100 µA Adjustment Pin Current Change ∆IAdj 10mA ≤ IL ≤ 1.5A – 0.2 5 µA 2.5V ≤ VI – Vo ≤ 40V Reference Voltage (Fig. 3)(4) Vref 10mA ≤ Io ≤ 1.5A 1.225 1.25 1.275 V 3V ≤ VI – Vo ≤ 40V Temperature Stability (Fig. 3) TS Tlow ≤ TJ ≤ Thigh – 1 – %Vo Min. Load Current to Maintain Regulation (Fig. 3) ILmin VI – Vo = 40V – 3.5 10 mA Maximum Output Current (Fig. 3) Imax VI – Vo ≤ 15V 1.5 2.2 – A VI – Vo = 40V, TJ = 25°C 0.15 0.4 – RMS Noise, % of Vo N TJ = 25°C, 10HZ ≤ f ≤ 10KHZ — 0.003 – %Vo Ripple Rejection (Fig. 4) RR Vo = 10V, f = 120HZ (5) — 65 – dB CAdj = 10 µF66 80 – Long-Term Stability (after 1000 hr) Fig. 3 S TJ = 125°C (6) , TJ = 25°C for – 0.3 1.0 % Endpoint Measurements Thermal Resistance Junction to Case R θJC Tlow ≤ TJ ≤ Thigh – 5.0 –°C/W Notes: (1) Tlow = 0°C Thigh = 125°C (2) Imax = 1.5A Pmax : TO-220 = 2W, TO-263 = 2W (3) Load and line regulation are specified at constant junction temperature. Changes in Vo due to heating effects must be taken into account separately. Pulse testing with low duty cycle is used. (4) Selected devices with tightened tolerance reference voltage available. (5) CAdj, when used, is connected between the addjustment pin and ground. (6) Since Long-Term Stability cannot be measured on each device before shipment, this specification is an engineering estimate of average stability from lot to lot. |
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