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WV3HG64M72EER806D6IMG bảng dữ liệu(PDF) 8 Page - White Electronic Designs Corporation |
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WV3HG64M72EER806D6IMG bảng dữ liệu(HTML) 8 Page - White Electronic Designs Corporation |
8 / 11 page WV3HG64M72EER-D6 ADVANCED 8 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs August 2006 Rev. 1 AC TIMING PARAMETERS (cont'd) AC CHARACTERISTICS 806 665 534 403 PARAMETER SYMBOL MIN MAX MIN MAX MIN MAX MIN MAX UNIT ACTIVE to ACTIVE (same bank) command tRC TBD TBD 55 55 55 ns ACTIVE bank a to ACTIVE bank b command tRRD TBD TBD 7.5 7.5 7.5 ns ACTIVE to READ or WRITE delay tRCD TBD TBD 15 15 15 ns Four Bank Activate period tFAW TBD TBD 37.5 37.5 37.5 37.5 37.5 37.5 ns ACTIVE to PRECHARGE command tRAS TBD TBD 40 70,000 40 70,000 40 70,000 ns Internal READ to precharge command delay tRTP TBD TBD 7.5 7.5 7.5 ns Write recovery time tWR TBD TBD 15 15 15 ns Auto precharge write recovery + precharge time tDAL TBD TBD tWR+tRP tWR+tRP tWR+tRP ns Internal WRITE to READ command delay tWTR TBD TBD 7.5 7.5 7.5 ns PRECHARGE command period tRP TBD TBD 15 15 15 ns PRECHARGE ALL command period tRPA TBD TBD tRP+tCK tRP+tCK tRP+tCK ns LOAD MODE command cycle time tMRD TBD TBD 22 2 tCK CKE low to CK,CK# uncertainty tDELAY TBD TBD tIS+tCK tIH tIS+tCK tIH tIS+tCK tIH ns REFRESH to Active of Refresh to Refresh command interfal tRFC TBD TBD 127.5 70,000 127.5 70,000 127.5 70,000 ns Average periodic refresh interval tREFI TBD TBD 7.8 7.8 7.8 µs Exit self refresh to non-READ command tXSNR TBD TBD tRFC(MIN) +10 tRFC(MIN) +10 tRFC(MIN) +10 ns Exit self refresh to READ command tXSRD TBD TBD 200 200 200 tCK Exit self refresh timing reference tISXR TBD TBD tIS tIS tIS ps ODT turn-on delay tAOND TBD TBD 2 22222 tCK ODT turn-on tAON TBD TBD tAC(MIN) tAC(MAX) +1000 tAC(MIN) tAC(MAX) +1000 tAC(MIN) tAC(MAX) +1000 ps ODT turn-off delay tAOFD TBD TBD 2.5 2.5 2.5 2.5 2.5 2.5 tCK ODT turn-off tAOF TBD TBD tAC(MIN) tAC(MAX) +600 tAC(MIN) tAC(MAX) +600 tAC(MIN) tAC(MAX) +600 ps ODT turn-on (power-down mode) tAONPD TBD TBD tAC(MIN) +2000 2 x tCK+ tAC(MAX) +1000 tAC(MIN) +2000 2 x tCK+ tAC(MAX) +1000 tAC(MIN) +2000 2 x tCK+ tAC(MAX) +1000 ps ODT turn-off (power-down mode) tAOFPD TBD TBD tAC(MIN) +2000 2.5 x tCK+ tAC(MAX) +1000 tAC(MIN) +2000 2.5 x tCK+ tAC(MAX) +1000 tAC(MIN) +2000 2.5 x tCK+ tAC(MAX) +1000 ps ODT to power-down entry latency tANPD TBD TBD 33 3 tCK ODT power-down exit latency tAXPD TBD TBD 88 8 tCK Exit active power-down to READ command, MR[bit12=0] tXARD TBD TBD 22 2 tCK Exit active power-down to READ command, MR[bit12=1] tXARDS TBD TBD 7-AL 6-AL 6-AL tCK A Exit precharge power-down to any non- READ command. tXP TBD TBD 22 2 tCK CKE minimum high/low time tCKE TBD TBD 33 3 tCK * AC specification is based on SAMSUNG components. Other DRAM manufactures specification may be different. |
Số phần tương tự - WV3HG64M72EER806D6IMG |
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Mô tả tương tự - WV3HG64M72EER806D6IMG |
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