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STCC02-ED5 bảng dữ liệu(PDF) 6 Page - STMicroelectronics |
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6 / 13 page STCC02-ED5 6/13 ■ Buzzer driver The MCU can drive a warning buzzer with a 50% PWM signal. The buzzer driver amplifies this signal in current and translates it from the 5V MCU output to the VCC supply to produce the right sound level from the buzzer. The output stage is made of a transistor and a 1.5 k Ω resistor. The transistor is referred to the power ground COM and is connected by its collector to the output BUZ3. It has a DC current rating of 17 mA and runs up to 5 kHz. Finally, the resistor is connected between the BUZ3 and VCC pins to discharge the capacitance of the buzzer at turn off and in off state. Table 2: Absolute Ratings (limiting values) Note 1: Refer to the Application Recommendations for the calcultation of the functional dissipation. Table 3: Electromagnetic Compatibility Ratings (TJ = 25°C, according to typical application diagram of page 1, unless otherwise specified) Table 4: Thermal Resistance Symbol Pin Parameter name & conditions Value Unit VDD VDD Output supply voltage - 0.3 to 6 V VIN VIN Input supply voltage - 0.3 to 30 V VDS, VCC DS, VCC Door switch and power supply voltage - 0.3 to 30 V VSYN SYN AC input voltage, RZV = 10kΩ - 1 to 30 V VMO BUZ1, MAG2, FAN1 Output voltage - 0.3 to 30 V VI IN1, IN2, IN3 Input logic voltage - 0.3 to VDD + 0.3V V VO ZVS, CDD, /RST Output logic voltage - 0.3 to VDD + 0.3V V IM DS, VCC Maximum sourced current pulse, tp = 10ms 120 mA MAG2, FAN1 Maximum sunk driver current pulse, tp = 1ms 120 mA Maximum DC sourced current 100 mA BUZ3 Maximum driver diode reverse current 15 mA Maximum DC sourced current 10 mA MAG2, FAN1 Maximum demagnetization diode reverse current 1 mA FMAX IN3, BUZ3 Maximum buzzer frequency 5 kHz PDIS All Operating dissipation, DIL-16 package (1) 0.65 W TAMB AII Operating ambient temperature, DIL-16 - 10 to 85 °C TJ All Operating junction temperature - 10 to 150 °C Storage junction temperature - 25 to 150 °C Symbol Node Parameter name & conditions Value Unit VESD All pins ESD protection, MIL-STD 883 method 3015, HBM model ± 2 kV Symbol Parameter Value Unit Rth(j-a) DIL-16 thermal resistance junction to ambient Copper thickness = 35µm 100 °C/W |
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Mô tả tương tự - STCC02-ED5 |
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