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LM2734ZMKX bảng dữ liệu(PDF) 11 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
tên linh kiện LM2734ZMKX
Giải thích chi tiết về linh kiện  Thin SOT23 1A Load Step-Down DC-DC Regulator
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Trang chủ  http://www.national.com
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LM2734ZMKX bảng dữ liệu(HTML) 11 Page - National Semiconductor (TI)

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Calculating the LM2734Z Junction
Temperature (Continued)
The second method can give a very accurate silicon junction
temperature. The first step is to determine RθJA of the appli-
cation. The LM2734Z has over-temperature protection cir-
cuitry. When the silicon temperature reaches 165˚C, the
device stops switching. The protection circuitry has a hyster-
esis of 15˚C. Once the silicon temperature has decreased to
approximately 150˚C, the device will start to switch again.
Knowing this, the RθJA for any PCB can be characterized
during the early stages of the design by raising the ambient
temperature in the given application until the circuit enters
thermal shutdown. If the SW-pin is monitored, it will be
obvious when the internal NFET stops switching indicating a
junction temperature of 165˚C. Knowing the internal power
dissipation from the above methods, the junction tempera-
ture and the ambient temperature, RθJA can be determined.
Once this is determined, the maximum ambient temperature
allowed for a desired junction temperature can be found.
Design Example 3:
Operating Conditions
Package
SOT23-6
V
IN
12.0V
P
OUT
2.475W
V
OUT
3.30V
P
DIODE
523mW
I
OUT
750mA
P
IND
56.25mW
V
D
0.35V
P
SWF
108mW
Freq
3MHz
P
SWR
108mW
I
Q
1.5mA
P
COND
68.2mW
I
BOOST
4mA
P
Q
18mW
V
BOOST
5V
P
BOOST
20mW
T
RISE
8ns
P
LOSS
902mW
T
FALL
8ns
R
DSON
400m
IND
DCR
75m
D
30.3%
Using a standard National Semiconductor Thin SOT23-6
demonstration board to determine the RθJA of the board. The
four layer PCB is constructed using FR4 with 1/2oz copper
traces. The copper ground plane is on the bottom layer. The
ground plane is accessed by two vias. The board measures
2.5cm x 3cm. It was placed in an oven with no forced airflow.
The ambient temperature was raised to 94˚C, and at that
temperature, the device went into thermal shutdown.
If the junction temperature was to be kept below 125˚C, then
the ambient temperature cannot go above 54.2˚C.
T
J -(R
θJA xPLOSS)= TA
The method described above to find the junction tempera-
ture in the Thin SOT23-6 package can also be used to
calculate the junction temperature in the LLP package. The 6
pin LLP package has a RθJC = 20˚C/W, and RθJA can vary
depending on the application. RθJA can be calculated in the
same manner as described in method #2 (see example 3).
LLP Package
The LM2734Z is packaged in a Thin SOT23-6 package and
the 6–pin LLP. The LLP package has the same footprint as
the Thin SOT23-6, but is thermally superior due to the ex-
posed ground paddle on the bottom of the package.
20130374
No Pullback LLP Configuration
RθJA of the LLP package is normally two to three times better
than that of the Thin SOT23-6 package for a similar PCB
configuration (area, copper weight, thermal vias).
20130370
FIGURE 7. Dog Bone
www.national.com
11


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