STPS200170TV1

2 Package mechanical data

5/7

2

Package mechanical data

Epoxy meets UL94, V0

Cooling method: by conduction (C)

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect . The category of

second level interconnect is marked on the package and on the inner box label, in compliance

with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also

marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are

available at: www.st.com.

Table 4.

ISOTOP dimensions

REF.

DIMENSIONS

Millimeters

Inches

Min.

Max

Min.

Max.

A

11.80

12.20

0.465

0.480

A1

8.90

9.10

0.350

0.358

B

7.8

8.20

0.307

0.323

C

0.75

0.85

0.030

0.033

C2

1.95

2.05

0.077

0.081

D

37.80

38.20

1.488

1.504

D1

31.50

31.70

1.240

1.248

E

25.15

25.50

0.990

1.004

E1

23.85

24.15

0.939

0.951

E2

24.80 typ.

0.976 typ.

G

14.90

15.10

0.587

0.594

G1

12.60

12.80

0.496

0.504

G2

3.50

4.30

0.138

0.169

F

4.10

4.30

0.161

0.169

F1

4.60

5.00

0.181

0.197

P

4.00

4.30

0.157

0.69

P1

4.00

4.40

0.157

0.173

S

30.10

30.30

1.185

1.193

F1

F

D1

G

D

S

B

E1

G1

ØP

P1

E

E2

G2

C

C2

A1

A