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IRF1404ZS bảng dữ liệu(PDF) 1 Page - International Rectifier |
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1 / 12 page 8/28/03 www.irf.com 1 AUTOMOTIVE MOSFET PD - 94634A HEXFET® Power MOSFET VDSS = 40V RDS(on) = 3.7mΩ ID = 75A Specifically designed for Automotive applications, this HEXFET® Power MOSFET utilizes the latest processing techniques to achieve extremely low on- resistance per silicon area. Additional features of this design are a 175°C junction operating tempera- ture, fast switching speed and improved repetitive avalanche rating . These features combine to make this design an extremely efficient and reliable device for use in Automotive applications and a wide variety of other applications. S D G Description ● Advanced Process Technology ● Ultra Low On-Resistance ● 175°C Operating Temperature ● Fast Switching ● Repetitive Avalanche Allowed up to Tjmax Features IRF1404Z IRF1404ZS IRF1404ZL D2Pak IRF1404ZS TO-220AB IRF1404Z TO-262 IRF1404ZL Absolute Maximum Ratings Parameter Units ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Silicon Limited) ID @ TC = 100°C Continuous Drain Current, VGS @ 10V A ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Package Limited) IDM Pulsed Drain Current PD @TC = 25°C Power Dissipation W Linear Derating Factor W/°C VGS Gate-to-Source Voltage V EAS (Thermally limited) Single Pulse Avalanche Energyd mJ EAS (Tested ) Single Pulse Avalanche Energy Tested Value h IAR Avalanche Current à A EAR Repetitive Avalanche Energy g mJ TJ Operating Junction and TSTG Storage Temperature Range °C Soldering Temperature, for 10 seconds Mounting Torque, 6-32 or M3 screw i Thermal Resistance Parameter Typ. Max. Units RθJC Junction-to-Case ––– 0.65 °C/W RθCS Case-to-Sink, Flat Greased Surface i 0.50 ––– RθJA Junction-to-Ambient i ––– 62 RθJA Junction-to-Ambient (PCB Mount) j ––– 40 480 320 See Fig.12a, 12b, 15, 16 220 1.5 ± 20 Max. 190 130 750 75 -55 to + 175 300 (1.6mm from case ) 10 lbf yin (1.1Nym) |
Số phần tương tự - IRF1404ZS |
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Mô tả tương tự - IRF1404ZS |
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