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TRS10E65F bảng dữ liệu(PDF) 3 Page - Toshiba Semiconductor

tên linh kiện TRS10E65F
Giải thích chi tiết về linh kiện  SiC Schottky Barrier Diode
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nhà sản xuất  TOSHIBA [Toshiba Semiconductor]
Trang chủ  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TRS10E65F bảng dữ liệu(HTML) 3 Page - Toshiba Semiconductor

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TRS10E65F
3
7.
7.
7.
7. Marking
Marking
Marking
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Fig.
Fig.
Fig.
Fig. 7.1
7.1
7.1
7.1 Marking
Marking
Marking
Marking
Note:
A line under a Lot No. identifies the indication of product Labels.
[[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]]
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS
compatibility of Product.
The RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the
restriction of the use of certain hazardous substances in electrical and electronic equipment.
Abbreviation Code
S10E65F
Part Number
TRS10E65F
8.
8.
8.
8. Usage Considerations
Usage Considerations
Usage Considerations
Usage Considerations
(1)
The absolute maximum ratings are rated values that must not be exceeded during operation, even for an
instant.
The following are the recommended general derating methods for designing a circuit board using this
device.
VRRM : VRRM has a temperature coefficient of 0.1 %/.
Take this coefficient into account when designing a circuit board that will be operated
in a low-temperature environment.
IF(DC) : We recommend that the worst-case current be no greater than 80 % of the absolute maximum
rating of IF(DC).
IFP
: We recommend that the worst-case current be no greater than 80 % of the absolute maximum
rating of IFP.
IFSM : This rating specifies a non-repetitive limit value.
This only applies to an abnormal operation, which seldom occurs during the lifespan of a device.
I2t
: This rating specifies a non-repetitive limit value.
This only applies to an abnormal operation, which seldom occurs during the lifespan of a device.
Tj
: Derate device parameters in proportion to this rating in order to ensure high reliability.
We recommend that the junction temperature (Tj) of a device be kept below 140 .
(2)
For other design considerations, see the Toshiba Semiconductor website.
2018-06-27
Rev.2.0
©2016-2018
Toshiba Electronic Devices & Storage Corporation


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