Silicom Ltd. Connectivity Solutions

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System Acceleration Throughput per a single controller:

INTEL® C628 CHIPSET/

INTEL® C627 CHIPSET

INTEL® C626 CHIPSET

INTEL® C625 CHIPSET

SSL/IPSec

100Gbps

40Gbps

20Gbps

Compression Deflate

100Gbps

40Gbps

20Gbps

Decompression Deflate

100Gbps

100Gbps

100Gbps

RSA Decrypt 1k-bit

550K Ops/sec

550K Ops/sec

550K Ops/sec

RSA Decrypt 2k-bit

100 Ops/Sec

40 Ops/Sec

20 Ops/Sec

TLS Handshakes ECDH_RSA2K

440K Ops/sec

TLS Handshakes EDHE+ECDSA 51K Ops/sec

SSL/IPSec + Compression +

PKE

Total 120 Gbps +

100K Ops/sec

Technical Specifications

General Technical Specifications:

Interface Standard:

PCI-Express Base Specification Revision 3.0 (8 GTs)

Board Size:

Low profile short add-

in card: 167.64 mm X 64.389mm (6.600”X 2.535”)

PCI Express Card Type:

X16 Lane

PCI Express Voltage

+12V +- 8% and external 3×2 connector

+3.3V AUX ± 9%

PCI Connector:

Gold Finger: X16

Controllers:

Intel® C628 Chipset

Intel® C627 Chipset

Intel® C626 Chipset

Intel® C625 Chipset

Holder:

Metal Bracket: Full Height and Low Height

Operating Humidity:

0%

–90%, non-condensing

Operating Temperature:

0°C

– 45°C (32°F – 113

F)

Air flow requirement for this adapter is 200 LFM

Cooling

Heatsink With Integrated Fan.

(Stretch-Goal of Fanless Operation, which will require modeling)

Storage:

-40°C

–65°C (-40°F–149°F)