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TMUX1308 bảng dữ liệu(PDF) 28 Page - Texas Instruments

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Giải thích chi tiết về linh kiện  TMUX13xx 5-V, Bidirectional 8:1, 1-Channel and 4:1, 2-Channel Multiplexers with Injection Current Control
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TMUX1308 bảng dữ liệu(HTML) 28 Page - Texas Instruments

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9.3 Design Requirements
For this design example, use the parameters listed in Table 9-1.
Table 9-1. Design Parameters
PARAMETERS
VALUES
Supply (VDD)
5.0 V
I/O signal range
0 V to VDD (Rail to Rail)
Control logic thresholds
1.8 V compatible
9.4 Detailed Design Procedure
The TMUX1308 and TMUX1309 can be operated without any external components except for the supply
decoupling capacitors. If the parts desired power-up state is disabled, the enable pin should have a weak pull-up
resistor and be controlled by the MCU through the GPIO. All inputs being muxed to the ADC of the MCU must
fall within the recommend operating conditions of the TMUX1308 and TMUX1309 including signal range and
continuous current. For this design with a supply of 5 V, the signal range can be 0 V to 5 V; the max continuous
current can be 100 mA at an ambient temperature of 85°C or 25 mA at 125°C.
10 Power Supply Recommendations
The TMUX1308 and TMUX1309 devices operate across a wide supply range of 1.62 V to 5.5 V. Note: do not
exceed the absolute maximum ratings because stresses beyond the listed ratings can cause permanent damage
to the devices.
Power-supply bypassing improves noise margin and prevents switching noise propagation from the VDD supply
to other components. Good power-supply decoupling is important to achieve optimum performance. For
improved supply noise immunity, use a supply decoupling capacitor ranging from 0.1 μF to 10 μF from VDD to
ground. Place the bypass capacitors as close to the power supply pins of the device as possible using low-
impedance connections. TI recommends using multi-layer ceramic chip capacitors (MLCCs) that offer low
equivalent series resistance (ESR) and inductance (ESL) characteristics for power-supply decoupling purposes.
For very sensitive systems, or for systems in harsh noise environments, avoiding the use of vias for connecting
the capacitors to the device pins may offer superior noise immunity. The use of multiple vias in parallel lowers
the overall inductance and is beneficial for connections to ground planes.
11 Layout
11.1 Layout Guidelines
11.1.1 Layout Information
When a PCB trace turns a corner at a 90° angle, a reflection can occur. A reflection occurs primarily because of
the change of width of the trace. At the apex of the turn, the trace width increases to 1.414 times the width. This
increase upsets the transmission-line characteristics, especially the distributed capacitance and self–inductance
of the trace which results in the reflection. Not all PCB traces can be straight; therefore, some traces must turn
corners. Figure 11-1 shows progressively better techniques of rounding corners. Only the last example (BEST)
maintains constant trace width and minimizes reflections.
TMUX1308, TMUX1309
SCDS426C – MARCH 2020 – REVISED AUGUST 2020
www.ti.com
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Copyright © 2020 Texas Instruments Incorporated
Product Folder Links: TMUX1308 TMUX1309


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[Old version datasheet]   TMUX13xx 5-V, Bidirectional 8:1, 1-Channel and 4:1, 2-Channel Multiplexers with Injection Current Control
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REVISED SEPTEMBER 2022
TMUX4051 TI-TMUX4051 Datasheet
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MAY 2022
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