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TLV803E, TLV809E, TLV810E

www.ti.com

SLVSES2F – AUGUST 2018 – REVISED JUNE 2020

Product Folder Links: TLV803E TLV809E TLV810E

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Copyright © 2018–2020, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Condition. Exposure to absolute-maximum-rated conditions (above the Recommended Operating Conditions) for extended

periods may affect device reliability.

(2)

(3)

As a result of the low dissipated power in this device, the junction temperature is assumed to be equal to the ambient temperature.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range, unless otherwise noted

(1)

MIN

MAX

UNIT

Voltage

VDD pin

–0.3

6.5

V

RESET (TLV809E), RESET (TLV810E)

–0.3

(2)

V

RESET (TLV803E)

–0.3

6.5

V

Voltage

MR

–0.3

(2)

V

Current

Output sink and source current

-20

20

mA

–40

125

°C

–65

150

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-

± 2000

V

Charged device model (CDM), per JEDEC specification

± 500

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input supply voltage

1.7

6

V

RESET pin and RESET pin voltage

0

6

V

RESET pin and RESET pin current

0

±5

mA

Junction temperature (free air temperature)

–40

125

°C

Manual reset pin voltage

0

V

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

TLV803E, TLV809E, TLV810E

UNIT

DPW (X2SON)

DCK (SC70-3)

DBZ (SOT23-3)

5 PINS

3 PINS

3 PINS

Junction-to-ambient thermal resistance

457.1

300.5

254.8

°C/W

Junction-to-case (top) thermal resistance

201.6

178.2

150.5

°C/W

Junction-to-board thermal resistance

320.4

166.5

140.1

°C/W

Junction-to-top characterization parameter

22.8

70

48.1

°C/W

Junction-to-board characterization parameter

318.8

165.2

139.1

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

°C/W