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SN74HCS264 bảng dữ liệu(PDF) 4 Page - Texas Instruments |
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4 / 23 page 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT VCC Supply voltage –0.5 7 V IIK Input clamp current(2) VI < –0.5 V or VI > VCC + 0.5 V ±20 mA IOK Output clamp current(2) VI < –0.5 V or VI > VCC + 0.5 V ±20 mA IO Continuous output current VO = 0 to VCC ±35 mA Continuous current through VCC or GND ±70 mA TJ Junction temperature(3) 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed. (3) Guaranteed by design. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/ JEDEC JS-001(1) ±4000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VCC Supply voltage 2 5 6 V VI Input voltage 0 VCC V VO Output voltage 0 VCC V TA Ambient temperature –40 125 °C 6.4 Thermal Information THERMAL METRIC(1) SN74HCS264 UNIT PW (TSSOP) D (SOIC) 16 PINS 16 PINS RθJA Junction-to-ambient thermal resistance 141.2 122.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 78.8 80.9 °C/W RθJB Junction-to-board thermal resistance 85.8 80.6 °C/W ΨJT Junction-to-top characterization parameter 27.7 40.4 °C/W ΨJB Junction-to-board characterization parameter 85.5 80.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. SN74HCS264 SCLS844 – AUGUST 2020 www.ti.com 4 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: SN74HCS264 |
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