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OPA388-Q1 bảng dữ liệu(PDF) 4 Page - Texas Instruments |
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OPA388-Q1 bảng dữ liệu(HTML) 4 Page - Texas Instruments |
4 / 31 page 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT Supply voltage VS = (V+) – (V–) Single-supply 6 V Dual-supply ±3 Signal input pins Voltage Common-mode (V–) – 0.5 (V+) + 0.5 V Differential (V+) – (V–) + 0.2 Current ±10 mA Output short circuit(2) Continuous Continuous Temperature Operating, TA –55 150 °C Junction, TJ 150 Storage, Tstg –65 150 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Short-circuit to ground, one amplifier per package. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) HBM ESD classification level 2 ±2000 V Charged-device model (CDM), per AEC Q100-011 CDM ESD classification level C5 ±750 (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Supply voltage, VS = (V+) – (V–) Single-supply 2.5 5.5 V Dual-supply ±1.25 ±2.75 Specified temperature –40 125 °C 6.4 Thermal Information THERMAL METRIC(1) OPA388-Q1 UNIT DBV (SOT-23) 5 PINS RθJA Junction-to-ambient thermal resistance 145.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 94.8 °C/W RθJB Junction-to-board thermal resistance 43.4 °C/W ΨJT Junction-to-top characterization parameter 24.7 °C/W ΨJB Junction-to-board characterization parameter 43.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. OPA388-Q1 SBOS989 – AUGUST 2020 www.ti.com 4 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: OPA388-Q1 |
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Mô tả tương tự - OPA388-Q1 |
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