6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage

Single-supply

6

V

Dual-supply

±3

Signal input pins

Voltage

Common-mode

(V–) – 0.5

(V+) + 0.5

V

Differential

(V+) – (V–) + 0.2

Current

±10

mA

Output short circuit(2)

Continuous

Continuous

Temperature

–55

150

°C

150

–65

150

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

Short-circuit to ground, one amplifier per package.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per AEC Q100-002(1)

HBM ESD classification level 2

±2000

V

Charged-device model (CDM), per AEC Q100-011

CDM ESD classification level C5

±750

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Single-supply

2.5

5.5

V

Dual-supply

±1.25

±2.75

Specified temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

OPA388-Q1

UNIT

DBV (SOT-23)

5 PINS

Junction-to-ambient thermal resistance

145.7

°C/W

Junction-to-case (top) thermal resistance

94.8

°C/W

Junction-to-board thermal resistance

43.4

°C/W

Junction-to-top characterization parameter

24.7

°C/W

Junction-to-board characterization parameter

43.1

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

OPA388-Q1

SBOS989 – AUGUST 2020

www.ti.com

4

Submit Document Feedback

Copyright © 2020 Texas Instruments Incorporated

Product Folder Links: OPA388-Q1