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CC3130 bảng dữ liệu(PDF) 73 Page - Texas Instruments

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tên linh kiện CC3130
Giải thích chi tiết về linh kiện  CC3130 SimpleLink??Wi-Fi짰 Wireless Network Processor with Coexistence for MCU Applications
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nhà sản xuất  TI [Texas Instruments]
Trang chủ  http://www.ti.com
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CC3130 bảng dữ liệu(HTML) 73 Page - Texas Instruments

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EXAMPLE BOARD LAYOUT
60X (0.5)
(
0.2) TYP
VIA
(R0.05) TYP
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
64X (0.6)
64X (0.24)
(8.8)
(8.8)
(
6.3)
(0.6) TYP
18X (1.2)
8X (1.1)
(0.6) TYP
18X (1.2)
8X
(1.1)
VQFN - 1 mm max height
RGK0064B
PLASTIC QUAD FLATPACK - NO LEAD
4222201/B 03/2018
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
SYMM
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SEE SOLDER MASK
DETAIL
1
16
17
32
33
48
49
64
65
METAL EDGE
SOLDER MASK
OPENING
EXPOSED METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
EXPOSED
METAL
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DEFINED
SOLDER MASK DETAILS


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