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MSP430FR6007 bảng dữ liệu(PDF) 36 Page - Texas Instruments

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MSP430FR6007, MSP430FR6005
SLASEV3 – MARCH 2020
www.ti.com
Submit Documentation Feedback
Product Folder Links: MSP430FR6007 MSP430FR6005
Specifications
Copyright © 2020, Texas Instruments Incorporated
(1)
For other module currents not listed here, see the module-specific parameter sections.
5.11 Typical Characteristics, Current Consumption per Module
(1)
MODULE
TEST CONDITIONS
REFERENCE CLOCK
MIN
TYP
MAX
UNIT
Timer_A
Module input clock
2.5
μA/MHz
Timer_B
Module input clock
3.8
μA/MHz
eUSCI_A
UART mode
Module input clock
6.3
7.0
μA/MHz
SPI mode
4.4
4.8
eUSCI_B
SPI mode
Module input clock
4.4
μA/MHz
I2C mode, 100 kbaud
4.4
RTC_C
32 kHz
100
nA
MPY
Only from start to end of operation
MCLK
28
μA/MHz
CRC16
Only from start to end of operation
MCLK
3.3
μA/MHz
CRC32
Only from start to end of operation
MCLK
3.3
μA/MHz
LEA
256-point complex FFT, data = nonzero
MCLK
68
86
µA/MHz
256-point complex FFT, data = zero
66
(1)
N/A = not applicable
(2)
For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
(3)
These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC (RθJC) value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment and application. For more information, see these EIA/JEDEC
standards:
JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
5.12 Thermal Resistance Characteristics for 100-Pin LQFP (PZ) Package
(1)
THERMAL METRIC(2)
VALUE(3)
UNIT
JA
Junction-to-ambient thermal resistance, still air
57.6
°C/W
JC(TOP)
Junction-to-case (top) thermal resistance
14.9
°C/W
JB
Junction-to-board thermal resistance
35.6
°C/W
ΨJB
Junction-to-board thermal characterization parameter
35.0
°C/W
ΨJT
Junction-to-top thermal characterization parameter
0.6
°C/W
JC(BOTTOM)
Junction-to-case (bottom) thermal resistance
N/A
°C/W


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