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MSP430FR6007 bảng dữ liệu(PDF) 36 Page - Texas Instruments |
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MSP430FR6007 bảng dữ liệu(HTML) 36 Page - Texas Instruments |
36 / 179 page 36 MSP430FR6007, MSP430FR6005 SLASEV3 – MARCH 2020 www.ti.com Submit Documentation Feedback Product Folder Links: MSP430FR6007 MSP430FR6005 Specifications Copyright © 2020, Texas Instruments Incorporated (1) For other module currents not listed here, see the module-specific parameter sections. 5.11 Typical Characteristics, Current Consumption per Module (1) MODULE TEST CONDITIONS REFERENCE CLOCK MIN TYP MAX UNIT Timer_A Module input clock 2.5 μA/MHz Timer_B Module input clock 3.8 μA/MHz eUSCI_A UART mode Module input clock 6.3 7.0 μA/MHz SPI mode 4.4 4.8 eUSCI_B SPI mode Module input clock 4.4 μA/MHz I2C mode, 100 kbaud 4.4 RTC_C 32 kHz 100 nA MPY Only from start to end of operation MCLK 28 μA/MHz CRC16 Only from start to end of operation MCLK 3.3 μA/MHz CRC32 Only from start to end of operation MCLK 3.3 μA/MHz LEA 256-point complex FFT, data = nonzero MCLK 68 86 µA/MHz 256-point complex FFT, data = zero 66 (1) N/A = not applicable (2) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics. (3) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC (RθJC) value, which is based on a JEDEC-defined 1S0P system) and will change based on environment and application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements 5.12 Thermal Resistance Characteristics for 100-Pin LQFP (PZ) Package (1) THERMAL METRIC(2) VALUE(3) UNIT RθJA Junction-to-ambient thermal resistance, still air 57.6 °C/W RθJC(TOP) Junction-to-case (top) thermal resistance 14.9 °C/W RθJB Junction-to-board thermal resistance 35.6 °C/W ΨJB Junction-to-board thermal characterization parameter 35.0 °C/W ΨJT Junction-to-top thermal characterization parameter 0.6 °C/W RθJC(BOTTOM) Junction-to-case (bottom) thermal resistance N/A °C/W |
Số phần tương tự - MSP430FR6007 |
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Mô tả tương tự - MSP430FR6007 |
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