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MSP430F2619 bảng dữ liệu(PDF) 39 Page - Texas Instruments

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tên linh kiện MSP430F2619
Giải thích chi tiết về linh kiện  MSP430F261x, MSP430F241x Mixed-Signal Microcontrollers
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MSP430F2619 bảng dữ liệu(HTML) 39 Page - Texas Instruments

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MSP430F2619, MSP430F2618, MSP430F2617, MSP430F2616
MSP430F2419, MSP430F2418, MSP430F2417, MSP430F2416
www.ti.com
SLAS541L – JUNE 2007 – REVISED MAY 2020
Submit Documentation Feedback
Product Folder Links: MSP430F2619 MSP430F2618 MSP430F2617 MSP430F2616 MSP430F2419 MSP430F2418
MSP430F2417 MSP430F2416
Specifications
Copyright © 2007–2020, Texas Instruments Incorporated
(1)
To improve EMI on the XT2 oscillator the following guidelines should be observed:
Keep the trace between the device and the crystal as short as possible.
Design a good ground plane around the oscillator pins.
Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
Use assembly materials and processes that avoid any parasitic load on the oscillator XIN and XOUT pins.
If conformal coating is used, make sure that it does not induce capacitive or resistive leakage between the oscillator pins.
Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other documentation. This
signal is no longer required for the serial programming adapter.
(2)
Includes parasitic bond and package capacitance (approximately 2 pF per pin). Because the PCB adds additional capacitance, verify the
correct load by measuring the ACLK frequency. For a correct setup, the effective load capacitance should always match the
specification of the used crystal.
(3)
Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
(4)
Frequencies below the MIN specification set the fault flag, frequencies above the MAX specification do not set the fault flag, and
frequencies in between might set the flag.
(5)
Measured with logic-level input frequency, but also applies to operation with crystals.
5.31 Crystal Oscillator LFXT1, High-Frequency Mode
(1)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
fLFXT1,HF0
LFXT1 oscillator crystal
frequency, HF mode 0
XTS = 1, LFXT1Sx = 0, XCAPx = 0
1.8 V to 3.6 V
0.4
1
MHz
fLFXT1,HF1
LFXT1 oscillator crystal
frequency, HF mode 1
XTS = 1, LFXT1Sx = 1, XCAPx = 0
1.8 V to 3.6 V
1
4
MHz
fLFXT1,HF2
LFXT1 oscillator crystal
frequency, HF mode 2
XTS = 1, LFXT1Sx = 2, XCAPx = 0
1.8 V to 3.6 V
2
10
MHz
2.2 V to 3.6 V
2
12
3 V to 3.6 V
2
16
fLFXT1,HF,logic
LFXT1 oscillator logic-level
square-wave input
frequency, HF mode
XTS = 1, LFXT1Sx = 3, XCAPx = 0
1.8 V to 3.6 V
0.4
10
MHz
2.2 V to 3.6 V
0.4
12
3 V to 3.6 V
0.4
16
OAHF
Oscillation allowance for HF
crystals (see Figure 5-23 and
Figure 5-24)
XTS = 1, XCAPx = 0, LFXT1Sx = 0,
fLFXT1,HF = 1 MHz, CL,eff = 15 pF
2700
XTS = 1, XCAPx = 0, LFXT1Sx = 1,
fLFXT1,HF = 4 MHz, CL,eff = 15 pF
800
XTS = 1, XCAPx = 0, LFXT1Sx = 2,
fLFXT1,HF = 16 MHz, CL,eff = 15 pF
300
CL,eff
Integrated effective load
capacitance, HF mode(2)
XTS = 1, XCAPx = 0(3)
1
pF
Duty cycle, HF mode
XTS = 1, XCAPx = 0,
Measured at P2.0/ACLK,
fLFXT1,HF = 10 MHz
2.2 V, 3 V
40%
50%
60%
XTS = 1, XCAPx = 0,
Measured at P2.0/ACLK,
fLFXT1,HF = 16 MHz
40%
50%
60%
fFault,HF
Oscillator fault frequency(4)
XTS = 1, LFXT1Sx = 3, XCAPx = 0(5)
2.2 V, 3 V
30
300
kHz


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