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MC34167 bảng dữ liệu(PDF) 9 Page - ON Semiconductor

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Giải thích chi tiết về linh kiện  POWER SWITCHING REGULATORS
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nhà sản xuất  ONSEMI [ON Semiconductor]
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MC34167 MC33167
9
MOTOROLA ANALOG IC DEVICE DATA
Figure 20. Step–Up/Down Converter
4
2
1
5
3
+
CF
RF
R1
1.5 k
CO
2200
VO
28 V/0.9 A
R2
EA
Reference
Thermal
Oscillator
S
R
Q
PWM
UVLO
ILIMIT
Vin
12 V
Cin
330
+
6.8 k
4.7 k
0.47
Q1
D1
1N5825
+
*Gate resistor RG, zener diode D3, and diode D4 are required only when Vin is greater than 20 V.
L
190
µH
*RG
620
D3
1N967A
D2
1N5822
Q2
MTP3055EL
D4
1N4148
+
+
Test
Conditions
Results
Line Regulation
Vin = 10 V to 24 V, IO = 0.9 A
10 mV =
± 0.017%
Load Regulation
Vin = 12 V, IO = 0.1 A to 0.9 A
30 mV =
± 0.053%
Output Ripple
Vin = 12 V, IO = 0.9 A
140 mVpp
Short Circuit Current
Vin = 12 V, RL = 0.1 Ω
6.0 A
Efficiency
Vin = 12 V, IO = 0.9 A
Vin = 24 V, IO = 0.9 A
80.1%
87.8%
L = Coilcraft M1496–A or General Magnetics Technology GMT–0223, 42 turns of #16 AWG on
Magnetics Inc. 58350–A2 core.
Heatsink = AAVID Engineering Inc.
MC34167: 5903B, or 5930B
MTP3055EL: 5925B
Figure 20 shows that the MC34167 can be configured as a step–up/down converter with the addition of an external power MOSFET. Energy is stored in the
inductor during the ON time of transistors Q1 and Q2. During the OFF time, the energy is transferred, with respect to ground, to the output filter capacitor and load.
This circuit configuration has two significant advantages over the basic step–up converter circuit. The first advantage is that output short circuit protection is
provided by the MC34167, since Q1 is directly in series with Vin and the load. Second, the output voltage can be programmed to be less than Vin. Notice that during
the OFF time, the inductor forward biases diodes D1 and D2, transferring its energy with respect to ground rather than with respect to Vin. When operating with Vin
greater than 20 V, a gate protection network is required for the MOSFET. The network consists of components RG, D3, and D4.
(Top View)
Vin
VO
CF
RF
R1
+–
+
+
+
D3
D2
RG
(Bottom View)
Figure 21. Step–Up/Down Converter Printed Circuit Board and Component Layout
3.45


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