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MC34151D bảng dữ liệu(PDF) 7 Page - ON Semiconductor |
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MC34151D bảng dữ liệu(HTML) 7 Page - ON Semiconductor |
7 / 12 page MC34151, MC33151 http://onsemi.com 7 LAYOUT CONSIDERATIONS High frequency printed circuit layout techniques are imperative to prevent excessive output ringing and overshoot. Do not attempt to construct the driver circuit on wire–wrap or plug–in prototype boards. When driving large capacitive loads, the printed circuit board must contain a low inductance ground plane to minimize the voltage spikes induced by the high ground ripple currents. All high current loops should be kept as short as possible using heavy copper runs to provide a low impedance high frequency path. For optimum drive performance, it is recommended that the initial circuit design contains dual power supply bypass capacitors connected with short leads as close to the VCC pin and ground as the layout will permit. Suggested capacitors are a low inductance 0.1 µF ceramic in parallel with a 4.7 µF tantalum. Additional bypass capacitors may be required depending upon Drive Output loading and circuit layout. Proper printed circuit board layout is extremely critical and cannot be over emphasized. The MC34151 greatly enhances the drive capabilities of common switching regulators and CMOS/TTL logic devices. Figure 18. Enhanced System Performance with Common Switching Regulators Figure 19. MOSFET Parasitic Oscillations Figure 20. Direct Transformer Drive Figure 21. Isolated MOSFET Drive Series gate resistor Rg may be needed to damp high frequency parasitic oscillations caused by the MOSFET input capacitance and any series wiring inductance in the gate–source circuit. Rg will decrease the MOSFET switching speed. Schottky diode D1 can reduce the driver’s power dissipation due to excessive ringing, by preventing the output pin from being driven below ground. Output Schottky diodes are recommended when driving inductive loads at high frequencies. The diodes reduce the driver’s power dissipation by preventing the output pins from being driven above VCC and below ground. + – VCC 47 0.1 6 5.7V TL494 or TL594 2 4 3 7 5 Vin + + ++ + + 1N5819 D1 Rg Vin + + 3 7 5 4 X 1N5819 + + + + 3 1N 5819 Isolation Boundary |
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