MC33465

http://onsemi.com

8

PACKAGE DIMENSIONS

(SOT–23)

N SUFFIX

PLASTIC PACKAGE

CASE 1212–01

ISSUE O

DIM

MIN

MAX

MILLIMETERS

A1

0.00

0.10

A2

1.00

1.30

B

0.30

0.50

C

0.10

0.25

D

2.80

3.00

E

2.50

3.10

E1

1.50

1.80

e

0.95 BSC

e1

1.90 BSC

L

L1

0.45

0.75

NOTES:

1. DIMENSIONS ARE IN MILLIMETERS.

2. INTERPRET DIMENSIONS AND TOLERANCES

PER ASME Y14.5M, 1994.

3. DATUM C IS A SEATING PLANE.

A

1

5

23

4

D

E1

B

L1

E

e

e1

C

M

0.10

C

S

B

S

A

A2

A1

S

0.05

C

L

0.20

–––

SOT–23–5

2.4

1.0

0.7 MAX.

0.95

0.95

1.9

(Unit: mm)

Recommended Footprint for Surface Mount Applications

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are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes

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MC33465/D