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MC33076P2 bảng dữ liệu(PDF) 8 Page - ON Semiconductor |
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MC33076P2 bảng dữ liệu(HTML) 8 Page - ON Semiconductor |
8 / 12 page MC33076 8 MOTOROLA ANALOG IC DEVICE DATA Figure 25. Percent Overshoot versus Load Capacitance CL, LOAD CAPACITANCE (pF) 10 k 1000 100 10 100 80 60 40 20 0 RL = 100 Ω RL = 2.0 kΩ VCC = +15 V VEE = –15 V TA = 25°C Figure 26. PC Board Heatsink Example Copper Pad Copper Pad APPLICATIONS INFORMATION The MC33076 dual operational amplifier is available in the standard 8–pin plastic dual–in–line (DIP) and surface mount packages, and also in a 16–pin batwing power package. To enhance the power dissipation capability of the power package, Pins 4, 5, 12, and 13 are tied together on the leadframe, giving it an ambient thermal resistance of 52 °C/W typically, in still air. The junction–to–ambient thermal resistance (R θJA) can be decreased further by using a copper padb on the printed circuit board (as shown in Figure 26) to draw the heat away from the package. Care must be taken not to exceed the maximum junction temperature or damage to the device may occur. |
Số phần tương tự - MC33076P2 |
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Mô tả tương tự - MC33076P2 |
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